M2S025-1FCS325
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- Mfr.Part #
- M2S025-1FCS325
- Manufacturer
- Microchip Technology
- Package / Case
- 325-TFBGA, CSPBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 325BGA
- Stock
- 25,838
- In Stock ：
- 25,838
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Height Seated (Max) :
- 1.01mm
- Reach Compliance Code :
- not_compliant
- Peripherals :
- DDR, PCIe, SERDES
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Width :
- 11mm
- Operating Temperature :
- 0°C~85°C TJ
- Power Supplies :
- 1.2V
- RAM Size :
- 64KB
- Number of Terminations :
- 325
- Length :
- 11mm
- Terminal Position :
- BOTTOM
- JESD-30 Code :
- S-PBGA-B325
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- HTS Code :
- 8542.39.00.01
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- JESD-609 Code :
- e0
- Supply Voltage-Max (Vsup) :
- 1.26V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Architecture :
- MCU, FPGA
- Number of Inputs :
- 180
- Terminal Pitch :
- 0.5mm
- Number of I/O :
- 180
- Number of Logic Cells :
- 27696
- Series :
- SmartFusion®2
- Qualification Status :
- Not Qualified
- RoHS Status :
- Non-RoHS Compliant
- Core Processor :
- ARM® Cortex®-M3
- Supply Voltage :
- 1.2V
- Package / Case :
- 325-TFBGA, CSPBGA
- Terminal Form :
- Ball
- Primary Attributes :
- FPGA - 25K Logic Modules
- Surface Mount :
- yes
- Published :
- 2015
- Supply Voltage-Min (Vsup) :
- 1.14V
- Speed :
- 166MHz
- Packaging :
- Tray
- Additional Feature :
- LG-MIN, WD-MIN
- Number of Outputs :
- 180
- Flash Size :
- 256KB
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Factory Lead Time :
- 10 Weeks
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Datasheets
- M2S025-1FCS325
325 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 180 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
ARM® Cortex®-M3 core processor(s) are used in the construction of this SoC.Manufacturer assigns package 325-TFBGA, CSPBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the SmartFusion®2 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.Taking note of the fact that this SoC security combines FPGA - 25K Logic Modules is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 180 I/Os.Use a power supply with a voltage of 1.2V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.A system on a chip benefits from having 325 terminations.A SoC chip like this can have 180 outputs.In order to operate system on chip, you will need 1.2V power supplies.This SoC chip has a total of 180 inputs that can be used.The logic SoC features 27696 logic cells.A flashing 256KB appears on it.This SoC processor also includes LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025-1FCS325 System On Chip (SoC) applications.
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
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