M2S010TS-VFG256I
- Mfr.Part #
- M2S010TS-VFG256I
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 256FBGA
- Stock
- 17,768
- In Stock :
- 17,768
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- JESD-609 Code :
- e3
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Core Processor :
- ARM® Cortex®-M3
- Length :
- 14mm
- Architecture :
- MCU, FPGA
- Supply Voltage-Max (Vsup) :
- 1.26V
- Supply Voltage-Min (Vsup) :
- 1.14V
- Number of Terminations :
- 256
- RAM Size :
- 64KB
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Speed :
- 166MHz
- Primary Attributes :
- FPGA - 10K Logic Modules
- Terminal Position :
- BOTTOM
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Cells :
- 12084
- Width :
- 14mm
- Supply Voltage :
- 1.2V
- Qualification Status :
- Not Qualified
- Power Supplies :
- 1.2V
- JESD-30 Code :
- S-PBGA-B256
- HTS Code :
- 8542.39.00.01
- Packaging :
- Tray
- Terminal Finish :
- MATTE TIN
- Terminal Form :
- Ball
- Peripherals :
- DDR, PCIe, SERDES
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Factory Lead Time :
- 10 Weeks
- Number of I/O :
- 138
- Surface Mount :
- yes
- Number of Inputs :
- 138
- Height Seated (Max) :
- 1.56mm
- Series :
- SmartFusion®2
- Flash Size :
- 256KB
- Package / Case :
- 256-LBGA
- Operating Temperature :
- -40°C~100°C TJ
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Outputs :
- 138
- RoHS Status :
- RoHS Compliant
- Additional Feature :
- LG-MIN, WD-MIN
- Terminal Pitch :
- 0.8mm
- Datasheets
- M2S010TS-VFG256I

256 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
On this SoC, there is ARM® Cortex®-M3 core processor.Assigned with the package 256-LBGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is a member of the SmartFusion®2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines FPGA - 10K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part includes 138 I/Os.It is recommended to use a 1.2V power supply.In the SoCs wireless, voltages above 1.26V are considered unsafe.This SoC system on a chip can run on a power supply that is at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 256 terminations, which is great for system on a chip.There are 138 outputs available on this SoC.A power supply of 1.2V is required to run system on chip.On the SoC chip, there are 138 inputs available for use.Logic system on chips consist of 12084 logic cells.There is a flash of 256KB on it.Further features of this SoC processor are LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010TS-VFG256I System On Chip (SoC) applications.
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
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