M2S010TS-1VF256I
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- Mfr.Part #
- M2S010TS-1VF256I
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 256FBGA
- Stock
- 24,346
- In Stock ：
- 24,346
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Factory Lead Time :
- 10 Weeks
- Additional Feature :
- LG-MIN, WD-MIN
- Supply Voltage :
- 1.2V
- Package / Case :
- 256-LFBGA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Packaging :
- Tray
- HTS Code :
- 8542.39.00.01
- JESD-30 Code :
- S-PBGA-B256
- Number of Terminations :
- 256
- RAM Size :
- 64KB
- Speed :
- 166MHz
- Peripherals :
- DDR, PCIe, SERDES
- Number of Inputs :
- 138
- JESD-609 Code :
- e0
- Width :
- 14mm
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Qualification Status :
- Not Qualified
- Operating Temperature :
- -40°C~100°C TJ
- Terminal Position :
- BOTTOM
- Core Processor :
- ARM® Cortex®-M3
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supply Voltage-Min (Vsup) :
- 1.14V
- Terminal Pitch :
- 0.8mm
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Supply Voltage-Max (Vsup) :
- 1.26V
- Flash Size :
- 256KB
- Primary Attributes :
- FPGA - 10K Logic Modules
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Surface Mount :
- yes
- Reach Compliance Code :
- not_compliant
- Power Supplies :
- 1.2V
- Series :
- SmartFusion®2
- Published :
- 2015
- Height Seated (Max) :
- 1.56mm
- Length :
- 14mm
- Architecture :
- MCU, FPGA
- Number of Outputs :
- 138
- RoHS Status :
- Non-RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Cells :
- 12084
- Terminal Form :
- Ball
- Number of I/O :
- 138
- Datasheets
- M2S010TS-1VF256I
256 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LFBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 10K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 138 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 256 terminations.This SoC chip is capable of having 138 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 138 inputs.System on chips of logic are comprised of 12084 logic cells.This flash has a size of 256KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010TS-1VF256I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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