M2S010TS-1FGG484M
- Mfr.Part #
- M2S010TS-1FGG484M
- Manufacturer
- Microchip Technology
- Package / Case
- 484-BGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 484FBGA
- Stock
- 24,922
- In Stock :
- 24,922
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Terminal Position :
- BOTTOM
- Peripherals :
- DDR, PCIe, SERDES
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Flash Size :
- 256KB
- Terminal Finish :
- MATTE TIN
- Number of Outputs :
- 233
- Supply Voltage :
- 1.2V
- Width :
- 23mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Inputs :
- 233
- Packaging :
- Tray
- Supply Voltage-Max (Vsup) :
- 1.26V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Primary Attributes :
- FPGA - 10K Logic Modules
- Series :
- SmartFusion®2
- Package / Case :
- 484-BGA
- Power Supplies :
- 1.2V
- Speed :
- 166MHz
- RAM Size :
- 64KB
- Number of Terminations :
- 484
- Supply Voltage-Min (Vsup) :
- 1.14V
- JESD-30 Code :
- S-PBGA-B484
- RoHS Status :
- RoHS Compliant
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Factory Lead Time :
- 10 Weeks
- Surface Mount :
- yes
- Number of I/O :
- 233
- JESD-609 Code :
- e3
- Terminal Form :
- Ball
- Qualification Status :
- Not Qualified
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Core Processor :
- ARM® Cortex®-M3
- Number of Logic Cells :
- 12084
- Height Seated (Max) :
- 2.44mm
- Architecture :
- MCU, FPGA
- Length :
- 23mm
- Terminal Pitch :
- 1mm
- Operating Temperature :
- -55°C~125°C TJ
- ECCN Code :
- 3A001.A.2.C
- HTS Code :
- 8542.39.00.01
- Datasheets
- M2S010TS-1FGG484M

484 Terminations -55°C~125°C TJ System On Chip SmartFusion®2 Series 233 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at -55°C~125°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 10K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 233 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.In order to run it, it must be fed by at least 1.14V of power.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 484 terminations in total.In order for this SoC chip to work properly, you can have 233 outputs.This system on chip SoC requires 1.2V power supply at all.The SoC chip is equipped with 233 inputs.In logic system on chips, there are 12084 logic cells.As for its flash size, it is 256KB.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010TS-1FGG484M System On Chip (SoC) applications.
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
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