M2S010T-VF256
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- Mfr.Part #
- M2S010T-VF256
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 256FBGA
- Stock
- 18,566
- In Stock ：
- 18,566
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Supply Voltage-Max (Vsup) :
- 1.26V
- Package / Case :
- 256-LFBGA
- Length :
- 14mm
- Number of I/O :
- 138
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Supply Voltage :
- 1.2V
- Series :
- SmartFusion®2
- Primary Attributes :
- FPGA - 10K Logic Modules
- Height Seated (Max) :
- 1.56mm
- Flash Size :
- 256KB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Terminations :
- 256
- HTS Code :
- 8542.39.00.01
- RAM Size :
- 64KB
- Speed :
- 166MHz
- Factory Lead Time :
- 10 Weeks
- JESD-30 Code :
- S-PBGA-B256
- Reach Compliance Code :
- not_compliant
- Terminal Position :
- BOTTOM
- Power Supplies :
- 1.2V
- Terminal Form :
- Ball
- Supply Voltage-Min (Vsup) :
- 1.14V
- Published :
- 2015
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of Logic Cells :
- 12084
- Number of Inputs :
- 138
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Width :
- 14mm
- Peripherals :
- DDR, PCIe, SERDES
- Number of Outputs :
- 138
- JESD-609 Code :
- e0
- RoHS Status :
- Non-RoHS Compliant
- Core Processor :
- ARM® Cortex®-M3
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Operating Temperature :
- 0°C~85°C TJ
- Architecture :
- MCU, FPGA
- Surface Mount :
- yes
- Terminal Pitch :
- 0.8mm
- Additional Feature :
- LG-MIN, WD-MIN
- Qualification Status :
- Not Qualified
- Datasheets
- M2S010T-VF256
256 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor(s) ARM® Cortex®-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 256-LFBGA.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion®2 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.This SoC security combines FPGA - 10K Logic Modules, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.138 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.If it has at least a 1.14V volt power supply, it can work fine.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.In total, there are 256 terminations, so system on a chip is really aided by this.There is the option to have 138 outputs on this SoC chip.As far as power supplies are concerned, system on chip requires 1.2V.Inputs are available on the SoC chip in the number of 138.There are 12084 logic cells in the logic system on chips.The flash size of the SoC meaning is 256KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010T-VF256 System On Chip (SoC) applications.
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
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