M2S010S-1FGG484I

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Mfr.Part #
M2S010S-1FGG484I
Manufacturer
Microsemi
Package / Case
484-BGA
Datasheet
Download
Description
IC SOC CORTEX-M3 166MHZ 484FBGA
Stock
27,205
In Stock :
27,205

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Manufacturer :
Microsemi
Product Category :
System On Chip (SoC)
Min Operating Temperature :
-40°C
Architecture :
MCU, FPGA
Core Architecture :
ARM
Package / Case :
484-BGA
Interface :
CAN, Ethernet, I2C, SPI, UART, USART, USB
Max Operating Temperature :
100°C
Published :
2016
Supplier Device Package :
484-FPBGA (23x23)
Frequency :
166MHz
RAM Size :
64KB
Series :
SmartFusion®2
Base Part Number :
M2S010S
Number of I/O :
233
RoHS Status :
RoHS Compliant
Primary Attributes :
FPGA - 10K Logic Modules
Flash Size :
256KB
Connectivity :
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed :
166MHz
Packaging :
Tray
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Core Processor :
ARM® Cortex®-M3
Peripherals :
DDR, PCIe, SERDES
Operating Temperature :
-40°C~100°C TJ
Datasheets
M2S010S-1FGG484I
Introducing System On Chip (SoC) Microsemi M2S010S-1FGG484I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:484-BGA, Base Part Number:M2S010S, Operating Temperature:-40°C~100°C TJ, M2S010S-1FGG484I pinout, M2S010S-1FGG484I datasheet PDF, M2S010S-1FGG484I amp .Beyond System On Chip (SoC) Microsemi M2S010S-1FGG484I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi M2S010S-1FGG484I


-40°C~100°C TJ M2S010S System On Chip SmartFusion®2 Series 233 I/O

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 10K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.233 I/Os are included in this SoC part.A 256KB flash can be seen on it.Search M2S010S for system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.For the SoC computing to start, -40°C is sufficient.This SoC system on chip operates at a maximum design temperature of 100°C.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


M2S010S-1FGG484I System On Chip (SoC) applications.


  • Body control module
  • Industrial transport
  • Industrial robot
  • High-end PLC
  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
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