M2S010S-1FG484I

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Mfr.Part #
M2S010S-1FG484I
Manufacturer
Microsemi
Package / Case
484-BGA
Datasheet
Download
Description
IC SOC CORTEX-M3 166MHZ 484FBGA
Stock
19,612
In Stock :
19,612

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Manufacturer :
Microsemi
Product Category :
System On Chip (SoC)
Primary Attributes :
FPGA - 10K Logic Modules
Min Operating Temperature :
-40°C
Operating Temperature :
-40°C~100°C TJ
Flash Size :
256KB
Max Operating Temperature :
100°C
Peripherals :
DDR, PCIe, SERDES
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Published :
2016
Base Part Number :
M2S010S
Number of I/O :
233
Package / Case :
484-BGA
Architecture :
MCU, FPGA
RAM Size :
64KB
Connectivity :
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Interface :
CAN, Ethernet, I2C, SPI, UART, USART, USB
Packaging :
Tray
Supplier Device Package :
484-FPBGA (23x23)
RoHS Status :
Non-RoHS Compliant
Speed :
166MHz
Core Architecture :
ARM
Series :
SmartFusion®2
Core Processor :
ARM® Cortex®-M3
Frequency :
166MHz
Datasheets
M2S010S-1FG484I
Introducing System On Chip (SoC) Microsemi M2S010S-1FG484I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Base Part Number:M2S010S, Package / Case:484-BGA, M2S010S-1FG484I pinout, M2S010S-1FG484I datasheet PDF, M2S010S-1FG484I amp .Beyond System On Chip (SoC) Microsemi M2S010S-1FG484I ,we also offer PSB21650ELV1.5G, HD46505SP-2, HD64412FIV, Our vast inventory has you covered. Contact us now for immediate solutions.

Microsemi M2S010S-1FG484I


-40°C~100°C TJ M2S010S System On Chip SmartFusion®2 Series 233 I/O

This SoC is built on ARM® Cortex®-M3 core processor(s).


Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion®2 series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 10K Logic Modules together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 233 I/Os.As for its flash size, it is 256KB.By searching M2S010S, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 166MHz is what the wireless SoC does.This SoC meaning utilizes a core architecture of ARM as its foundation.It just takes -40°C for the SoC computing to start up, and that is all it needs.There is a design maximum operating temperature 100°C specified for this SoC system on chip.

ARM® Cortex®-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM


There are a lot of Microsemi Corporation


M2S010S-1FG484I System On Chip (SoC) applications.


  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness
  • Healthcare
  • Medical
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