M2S010-VF256
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- Mfr.Part #
- M2S010-VF256
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 256FBGA
- Stock
- 15,705
- In Stock ：
- 15,705
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Operating Temperature :
- -40°C~100°C TJ
- Supply Voltage-Max (Vsup) :
- 1.26V
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 2 days ago)
- RAM Size :
- 64KB
- JESD-609 Code :
- e0
- Package / Case :
- 256-LFBGA
- Primary Attributes :
- FPGA - 10K Logic Modules
- Factory Lead Time :
- 8 Weeks
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Qualification Status :
- Not Qualified
- Architecture :
- MCU, FPGA
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Additional Feature :
- LG-MIN, WD-MIN
- Number of Outputs :
- 138
- Length :
- 14mm
- Surface Mount :
- yes
- Published :
- 2015
- Reach Compliance Code :
- not_compliant
- HTS Code :
- 8542.39.00.01
- Width :
- 14mm
- Core Processor :
- ARM® Cortex®-M3
- Packaging :
- Tray
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Speed :
- 166MHz
- Peripherals :
- DDR, PCIe, SERDES
- JESD-30 Code :
- S-PBGA-B256
- Number of Logic Cells :
- 12084
- Number of Inputs :
- 138
- Number of Terminations :
- 256
- Supply Voltage-Min (Vsup) :
- 1.14V
- Terminal Pitch :
- 0.8mm
- Power Supplies :
- 1.2V
- Supply Voltage :
- 1.2V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Flash Size :
- 256KB
- RoHS Status :
- Non-RoHS Compliant
- Terminal Position :
- BOTTOM
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of I/O :
- 138
- Terminal Form :
- Ball
- Height Seated (Max) :
- 1.56mm
- Series :
- SmartFusion®2
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Datasheets
- M2S010-VF256
256 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC is built.Package 256-LFBGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion®2.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 10K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.138 I/Os are included in this SoC part.A 1.2V power supply is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.At least 1.14V can be supplied as a power source.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 256 terminations, which makes system on a chip possible.A SoC chip with 138 outputs is available.A power supply of 1.2V is required.A SoC chip with 138 inputs is available.A logic SoC has 12084 logic cells.A 256KB flash can be seen on it.Aside from that, this SoC processor features LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010-VF256I System On Chip (SoC) applications.
- Body control module
- Industrial transport
- Industrial robot
- High-end PLC
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
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