M2S010-1VF256
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- Mfr.Part #
- M2S010-1VF256
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 256FBGA
- Stock
- 37,392
- In Stock ：
- 37,392
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Series :
- SmartFusion®2
- Width :
- 14mm
- Number of Inputs :
- 138
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Reach Compliance Code :
- not_compliant
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Flash Size :
- 256KB
- Supply Voltage-Min (Vsup) :
- 1.14V
- Number of Outputs :
- 138
- Supply Voltage :
- 1.2V
- HTS Code :
- 8542.39.00.01
- Architecture :
- MCU, FPGA
- Primary Attributes :
- FPGA - 10K Logic Modules
- Power Supplies :
- 1.2V
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Factory Lead Time :
- 10 Weeks
- Packaging :
- Tray
- JESD-609 Code :
- e0
- Terminal Position :
- BOTTOM
- Core Processor :
- ARM® Cortex®-M3
- JESD-30 Code :
- S-PBGA-B256
- RoHS Status :
- Non-RoHS Compliant
- Qualification Status :
- Not Qualified
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Published :
- 2015
- RAM Size :
- 64KB
- Speed :
- 166MHz
- Number of Terminations :
- 256
- Peripherals :
- DDR, PCIe, SERDES
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Logic Cells :
- 12084
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Surface Mount :
- yes
- Package / Case :
- 256-LFBGA
- Additional Feature :
- LG-MIN, WD-MIN
- Terminal Form :
- Ball
- Length :
- 14mm
- Operating Temperature :
- 0°C~85°C TJ
- Height Seated (Max) :
- 1.56mm
- Supply Voltage-Max (Vsup) :
- 1.26V
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of I/O :
- 138
- Terminal Pitch :
- 0.8mm
- Datasheets
- M2S010-1VF256
256 Terminations 0°C~85°C TJ System On Chip SmartFusion®2 Series 138 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
A core processor ARM® Cortex®-M3 is used to build this SoC.Its package is 256-LFBGA.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion®2 series.For this SoC meaning, the average operating temperature should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 10K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 138.A 1.2V power supply should be used.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.Having 256 terminations in total makes system on a chip possible.It is possible to use this SoC chip with 138 outputs.You will need to provide 1.2V power supplies in order to run system on chip.A SoC chip with 138 inputs is available to the user.12084 logic cells are included in logic system on chips.There is a flash of 256KB.The SoC processor also includes LG-MIN, WD-MIN, which are additional features.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010-1VF256 System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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