M2S005S-VF256
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- Mfr.Part #
- M2S005S-VF256
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 256FBGA
- Stock
- 35,220
- In Stock ：
- 35,220
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Published :
- 2015
- Core Processor :
- ARM® Cortex®-M3
- Terminal Pitch :
- 0.8mm
- Supply Voltage-Min (Vsup) :
- 1.14V
- Number of Logic Cells :
- 6060
- Number of Outputs :
- 161
- Length :
- 14mm
- Width :
- 14mm
- Terminal Position :
- BOTTOM
- JESD-609 Code :
- e0
- Number of Terminations :
- 256
- Operating Temperature :
- -40°C~100°C TJ
- Flash Size :
- 128kB
- Number of I/O :
- 161
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RAM Size :
- 64KB
- RoHS Status :
- Non-RoHS Compliant
- Number of Inputs :
- 161
- Reach Compliance Code :
- not_compliant
- Qualification Status :
- Not Qualified
- Surface Mount :
- yes
- JESD-30 Code :
- S-PBGA-B256
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Supply Voltage :
- 1.2V
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Terminal Form :
- Ball
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Factory Lead Time :
- 12 Weeks
- Peripherals :
- DDR
- Additional Feature :
- LG-MIN, WD-MIN
- Speed :
- 166MHz
- Power Supplies :
- 1.2V
- Primary Attributes :
- FPGA - 5K Logic Modules
- Package / Case :
- 256-LFBGA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Architecture :
- MCU, FPGA
- Height Seated (Max) :
- 1.56mm
- Series :
- SmartFusion®2
- Packaging :
- Tray
- Supply Voltage-Max (Vsup) :
- 1.26V
- HTS Code :
- 8542.39.00.01
- Datasheets
- M2S005S-VF256
256 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 161 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LFBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 5K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 161 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 256 terminations.This SoC chip is capable of having 161 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 161 inputs.System on chips of logic are comprised of 6060 logic cells.This flash has a size of 128KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S005S-VF256I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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