M2S005-VF256I
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- Mfr.Part #
- M2S005-VF256I
- Manufacturer
- Microchip Technology
- Package / Case
- 256-LFBGA
- Datasheet
- Download
- Description
- IC SOC CORTEX-M3 166MHZ 256FBGA
- Stock
- 18,761
- In Stock ：
- 18,761
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- Manufacturer :
- Microchip Technology
- Product Category :
- System On Chip (SoC)
- Package / Case :
- 256-LFBGA
- Lifecycle Status :
- IN PRODUCTION (Last Updated: 1 month ago)
- Number of Terminations :
- 256
- Power Supplies :
- 1.2V
- Number of Outputs :
- 161
- Speed :
- 166MHz
- Supply Voltage :
- 1.2V
- Surface Mount :
- yes
- Operating Temperature :
- -40°C~100°C TJ
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Width :
- 14mm
- Primary Attributes :
- FPGA - 5K Logic Modules
- Terminal Position :
- BOTTOM
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Additional Feature :
- LG-MIN, WD-MIN
- Core Processor :
- ARM® Cortex®-M3
- Architecture :
- MCU, FPGA
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of I/O :
- 161
- HTS Code :
- 8542.39.00.01
- Series :
- SmartFusion®2
- JESD-30 Code :
- S-PBGA-B256
- RoHS Status :
- Non-RoHS Compliant
- Supply Voltage-Max (Vsup) :
- 1.26V
- JESD-609 Code :
- e0
- Qualification Status :
- Not Qualified
- Supply Voltage-Min (Vsup) :
- 1.14V
- Terminal Pitch :
- 0.8mm
- Number of Inputs :
- 161
- Number of Logic Cells :
- 6060
- Peripherals :
- DDR
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Packaging :
- Tray
- Length :
- 14mm
- Flash Size :
- 128kB
- Height Seated (Max) :
- 1.56mm
- RAM Size :
- 64KB
- Connectivity :
- CANbus, Ethernet, I2C, SPI, UART/USART, USB
- Published :
- 2015
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Factory Lead Time :
- 6 Weeks
- Terminal Form :
- Ball
- Reach Compliance Code :
- not_compliant
- Datasheets
- M2S005-VF256I
256 Terminations -40°C~100°C TJ System On Chip SmartFusion®2 Series 161 I/O 1.2V
This SoC is built on ARM® Cortex®-M3 core processor(s).
Based on the core processor(s) ARM® Cortex®-M3, this SoC has been developed.There is a 256-LFBGA package assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.SmartFusion®2 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of FPGA - 5K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 161 inputs and outputs.Ideally, a power supply with a voltage of 1.2V should be used.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As long as it receives a power supply that is at least 1.14V, it should be able to function.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 256 terminations.This SoC chip is capable of having 161 outputs, which is convenient.There is 1.2V power supply requirement for this system on chip SoC.The SoC chip offers 161 inputs.System on chips of logic are comprised of 6060 logic cells.This flash has a size of 128KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.
ARM® Cortex®-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S005-VF256I System On Chip (SoC) applications.
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
- Fitness
- Healthcare
- Medical
- Remote control
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