LPC5506JBD64E

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Mfr.Part #
LPC5506JBD64E
Manufacturer
NXP Semiconductors
Package / Case
64-TQFP Exposed Pad
Datasheet
Download
Description
IC MCU 32BIT 256KB FLASH 64HTQFP
Stock
23,478
In Stock :
23,478

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Interface Type :
CAN/I2C/I2S/SPI/USART
Maximum Operating Supply Voltage (V) :
3.6
Maximum Operating Temperature (°C) :
105
PCB changed :
64
ADC Resolution (bit) :
16
Device Core :
ARM Cortex M33
Core Architecture :
ARM
Peripherals :
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
RAM Size :
96kB
Maximum CPU Frequency (MHz) :
96
Ethernet :
0
No. of Timers :
5
EEPROM Size :
-
Series :
-
Data Bus Width :
32bit
Connectivity :
CANbus, Flex COMM, I²C, SPI, UART/USART
Speed :
96MHz
I2C :
8
Operating Temperature :
-40°C ~ 105°C (TA)
Package Width :
10
Number of I/Os :
45 I/O
Package Length :
10
Core Processor :
ARM® Cortex®-M33
USB :
0
Packaging :
Tray
Pin Count :
64
Supplier Device Package :
64-HTQFP (10x10)
Minimum Operating Supply Voltage (V) :
1.8
Programmability :
yes
Maximum Clock Rate (MHz) :
96
Package / Case :
64-TQFP Exposed Pad
I2S :
8
Mounting Type :
Surface Mount
Minimum Operating Temperature :
- 40 C
Voltage - Supply (Vcc/Vdd) :
1.8V ~ 3.6V
Data Bus Width (bit) :
32
Supplier Package :
HTQFP EP
Program Memory Size :
256KB
Number of I/O :
45
RoHS Status :
RoHS Compliant
Instruction Set Architecture :
RISC
Oscillator Type :
Internal
Typical Operating Supply Voltage (V) :
3.3
Product Status :
Active
Minimum Operating Temperature (°C) :
-40
Number of ADCs :
Single
SPI :
7
Package :
Tray
Interfaces :
CAN, I2C, I2S, SPI, UART, USART
Core Size :
32-Bit Single-Core
USART :
8
UART :
0
Mounting Style :
SMD/SMT
ECCN (US) :
3A991.A.2
Package Height :
1.05(Max)
Mounting :
Surface Mount
Maximum Operating Temperature :
+ 105 C
Base Product Number :
LPC5506
MSL :
MSL 3 - 168 hours
Data Converters :
A/D 9x16b SAR
Program Memory Type :
Flash
Datasheets
LPC5506JBD64E
Introducing Microcontrollers NXP Semiconductors LPC5506JBD64E from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C ~ 105°C (TA), Package / Case:64-TQFP Exposed Pad, Mounting Type:Surface Mount, LPC5506JBD64E pinout, LPC5506JBD64E datasheet PDF, LPC5506JBD64E amp .Beyond Microcontrollers NXP Semiconductors LPC5506JBD64E ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC5506JBD64E


Microcontrollers NXP Semiconductors LPC5506JBD64E Overview

The LPC5506JBD64E from NXP Semiconductors represents a cutting-edge solution in the realm of Microcontrollers, designed to meet the demanding requirements of modern embedded applications. This 32-bit MCU is built on a robust architecture that supports a wide range of applications, ensuring reliability and performance. With 256KB of flash memory and a versatile 64HTQFP package, it is optimized for efficiency and scalability, making it ideal for both high-volume manufacturing and precise, small-scale applications. The inclusion of advanced security features and high-speed interfaces enhances its utility in a connected environment, ensuring that the Microcontrollers NXP Semiconductors LPC5506JBD64E is a go-to choice for developers and engineers looking for a reliable microcontroller platform.

LPC5506JBD64E Features

The LPC5506JBD64E microcontroller boasts a robust set of features that enhance its applicability across various domains. Key features include a 32-bit ARM Cortex-M33 processor, offering efficient processing capabilities with low power consumption. The device's 256KB flash memory ensures ample space for complex applications and software updates. High-speed communication interfaces such as SPI, UART, and I2C facilitate easy integration into existing systems, while advanced security protocols provide the necessary safeguards for sensitive data.

LPC5506JBD64E Applications

  • Industrial Automation: In industrial settings, the LPC5506JBD64E can be used to control and monitor automated production lines, improving efficiency and precision in operations.
  • Smart Home Devices: This MCU is ideal for smart home applications, enabling the development of connected devices that can be managed remotely, such as smart thermostats and security systems.
  • Wearable Technology: The low power consumption and compact form factor make it suitable for wearable devices, such as fitness trackers and smartwatches, enhancing user interaction and functionality.
  • Medical Devices: The LPC5506JBD64E supports applications in medical devices, where reliability and accuracy are paramount. It can be used in portable medical diagnostics or monitoring equipment, offering dependable performance and connectivity.
  • Automotive Products: Its robust processing capabilities and resistance to harsh environments make it suitable for automotive applications, including sensor-based monitoring systems and advanced vehicular controls.
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