LPC4337JBD144E

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Mfr.Part #
LPC4337JBD144E
Manufacturer
NXP Semiconductors
Package / Case
144-LQFP
Datasheet
Download
Description
IC MCU 32BIT 1MB FLASH 144LQFP
Stock
7,099
In Stock :
7,099

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Surface Mount :
yes
Data Converter :
A/D 8x10b; D/A 1x10b
Qualification Status :
Not Qualified
Terminal Position :
QUAD
ROM (words) :
1048576
Oscillator Type :
Internal
Voltage - Supply (Vcc/Vdd) :
2.2V~3.6V
Clock Frequency :
25MHz
Mounting Type :
Surface Mount
Number of Terminations :
144
Bit Size :
32
Terminal Form :
Gull wing
Supply Voltage-Min (Vsup) :
2.2V
Width :
20mm
Series :
LPC43xx
Supply Voltage-Max (Vsup) :
3.6V
Operating Temperature :
-40°C~105°C TA
PWM Channels :
yes
RoHS Status :
ROHS3 Compliant
Published :
2010
Length :
20mm
JESD-30 Code :
S-PQFP-G144
Program Memory Size :
1MB 1M x 8
Address Bus Width :
24
Package / Case :
144-LQFP
DAC Channels :
yes
Pin Count :
144
Packaging :
Tray
Connectivity :
I²C, IrDA, LINbus, SPI, UART/USART
CPU Family :
CORTEX-M4
DMA Channels :
yes
Core Processor :
ARM® Cortex®-M4/M0
Program Memory Type :
Flash
Has ADC :
yes
Number of I/O :
83
External Data Bus Width :
32
Speed :
204MHz
RAM Size :
136K x 8
Core Size :
32-Bit Dual-Core
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peripherals :
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Factory Lead Time :
12 Weeks
Base Part Number :
LPC4337
Power Supplies :
2.5/3.3V
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Height Seated (Max) :
1.6mm
Terminal Pitch :
0.5mm
EEPROM Size :
16K x 8
Supply Voltage :
3.3V
Datasheets
LPC4337JBD144E
Introducing Microcontrollers NXP Semiconductors LPC4337JBD144E from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:144, Operating Temperature:-40°C~105°C TA, Package / Case:144-LQFP, Base Part Number:LPC4337, LPC4337JBD144E pinout, LPC4337JBD144E datasheet PDF, LPC4337JBD144E amp .Beyond Microcontrollers NXP Semiconductors LPC4337JBD144E ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC4337JBD144E


Microcontrollers NXP Semiconductors LPC4337JBD144E Overview

The Microcontrollers NXP Semiconductors LPC4337JBD144E is an advanced microcontroller unit (MCU) that serves as a powerful solution for a variety of complex digital and mixed-signal applications. Designed by NXP Semiconductors, this MCU incorporates a dual-core architecture with ARM Cortex-M4 and Cortex-M0 processors, enabling efficient multitasking and enhanced system control. With 1MB of flash memory and a 144LQFP package, it provides a robust platform for developers seeking high-performance and scalable options in their circuit designs.

LPC4337JBD144E Features

The LPC4337JBD144E MCU stands out due to its comprehensive feature set, including:

  • 32-bit ARM Cortex-M4 and Cortex-M0 dual-core configuration for balanced performance and power efficiency.
  • 1MB on-chip flash memory, facilitating extensive code storage and swift data access.
  • High-speed USB interfaces with on-the-go capability, ensuring versatile connectivity options.
  • Advanced peripheral set supporting digital and analog functionality, which enhances application flexibility.
  • Low power consumption modes, which are essential for battery-operated devices.

LPC4337JBD144E Applications

  • Industrial Automation: Utilized in control systems for sensors and actuators, improving processing capabilities and system response times.
  • Medical Devices: Serves as a control unit in medical imaging systems due to its high data handling efficiency and reliability.
  • Automotive Systems: Applied in vehicle infotainment systems, offering robust support for complex user interfaces and connectivity features.
  • Consumer Electronics: Powers smart home devices, enhancing user interaction and connectivity through high-performance computing.
  • Communication Systems: Acts as a core component in communication infrastructure, optimizing data transmission and signal processing.
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