LPC4310FET100

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Mfr.Part #
LPC4310FET100
Manufacturer
NXP Semiconductors
Package / Case
100-TFBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 100TFBGA
Stock
27,801
In Stock :
27,801

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Number of DACs :
Single
Pin Count :
100
DAC Resolution (bit) :
10
Core Size :
32-Bit Dual-Core
Base Product Number :
LPC4310
Watchdog :
1
Core Processor :
ARM® Cortex®-M4/M0
Program Memory Type :
ROMless
Package Length :
9.1(Max)
RoHS Status :
RoHS Compliant
Oscillator Type :
Internal
CECC Qualified :
No
Minimum Operating Temperature (°C) :
-40
ECCN (US) :
EAR99
Supplier Package :
TFBGA
Mounting :
Surface Mount
Instruction Set Architecture :
RISC
Voltage - Supply (Vcc/Vdd) :
2.2V ~ 3.6V
UART :
1
Peripherals :
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number of I/O :
49
Lead Shape :
Ball
Program Memory Size :
-
Series :
LPC43xx
Maximum Power Dissipation (mW) :
1500
Typical Operating Supply Voltage (V) :
3.3|2.5
Package Width :
9.1(Max)
Data Converters :
A/D 4x10b; D/A 1x10b
Maximum Clock Rate (MHz) :
180
Maximum CPU Frequency (MHz) :
180
Package / Case :
100-TFBGA
Maximum Operating Supply Voltage (V) :
3.6
Package :
Bulk
Interface Type :
CAN/I2C/I2S/SPI/UART/USART
No. of Timers :
6
Maximum Operating Temperature (°C) :
85
RAM Size :
168KB
Package Height :
0.8(Max)
I2S :
2
Number of ADCs :
Dual
Supplier Device Package :
100-TFBGA (9x9)
SPI :
4
Standard Package Name :
BGA
Data Bus Width (bit) :
32
Ethernet :
0
USB :
0
Connectivity :
CANbus, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Core Architecture :
ARM
Mounting Type :
Surface Mount
PWM :
1
Family Name :
LPC4300
HTS :
8542.31.00.01
Operating Temperature :
-40°C ~ 85°C (TA)
DAC Channels :
1
PCB changed :
100
Special Feature :
CAN Controller
EEPROM Size :
-
Minimum Operating Supply Voltage (V) :
2.2
Product Status :
Active
USART :
3
Programmability :
No
ADC Resolution (bit) :
10/10
Speed :
204MHz
I2C :
2
Device Core :
ARM Cortex M4/M0
Datasheets
LPC4310FET100
Introducing Microcontrollers NXP Semiconductors LPC4310FET100 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:100-TFBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C ~ 85°C (TA), LPC4310FET100 pinout, LPC4310FET100 datasheet PDF, LPC4310FET100 amp .Beyond Microcontrollers NXP Semiconductors LPC4310FET100 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC4310FET100


Microcontrollers NXP Semiconductors LPC4310FET100 Overview

The Microcontrollers NXP Semiconductors LPC4310FET100 is a powerful, highly versatile 32-bit microcontroller that caters to a broad range of applications, especially where efficiency, reliability, and high-speed processing are required. This ROM-less MCU from NXP Semiconductors offers a flexible platform for design engineers, integrating advanced peripherals and support for multiple high-speed communication protocols. With its lack of on-chip ROM, the LPC4310FET100 allows designers to customize memory configurations, addressing specific needs and optimizing system performance.

LPC4310FET100 Features

The LPC4310FET100 boasts significant features that make it suitable for sophisticated applications. Key features include its dual-core configuration, consisting of an ARM Cortex-M4F and a Cortex-M0 processor. This unique setup enables efficient division of tasks and enhances performance through parallel processing. Additional features include high-speed USB 2.0 interface, a versatile DMA system, and extensive I/O options. Its 100TFBGA package ensures a compact footprint while providing sufficient I/O capabilities for even the most demanding tasks.

LPC4310FET100 Applications

  • Industrial Automation: Utilized in managing complex automation systems, the LPC4310FET100's robust processing power and multiple I/O interfaces can handle multiple sensor inputs and actuator controls seamlessly.
  • Medical Devices: Ideal for wearable health monitors and advanced diagnostic systems, where its capability for high data rate processing ensures rapid analysis and reliable performance.
  • Communication Systems: Used in communication equipment such as routers and switches, the high-speed interfaces and dual-core architecture facilitate efficient data handling and throughput.
  • Consumer Electronics: Powers advanced consumer electronics, including gaming consoles and smart home devices, offering rich multimedia experiences and responsive user interfaces.
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