LPC2926FBD144,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

RAM Size :

56K x 8

Series :

LPC2900

Height Seated (Max) :

1.6mm

DAC Channels :

No

Surface Mount :

yes

Core Processor :

ARM9®

Core Size :

16/32-Bit

JESD-609 Code :

e3

Operating Temperature :

-40°C~85°C TA

EEPROM Size :

16K x 8

Voltage - Supply (Vcc/Vdd) :

1.71V~3.6V

RoHS Status :

ROHS3 Compliant

Mounting Type :

Surface Mount

DMA Channels :

yes

Terminal Position :

QUAD

Terminal Finish :

Tin (Sn)

Peak Reflow Temperature (Cel) :

260

Moisture Sensitivity Level (MSL) :

2 (1 Year)

Clock Frequency :

40MHz

ROM (words) :

262144

Source Url Status Check Date :

2013-10-15 00:00:00

Number of I/O :

104

Address Bus Width :

24

Published :

2010

Power Supplies :

1.83.33.3/5V

Peripherals :

DMA, POR, PWM, WDT

Bit Size :

32

Supply Voltage :

1.8V

Factory Lead Time :

12 Weeks

Program Memory Type :

Flash

Packaging :

Tray

Pin Count :

144

Number of Terminations :

144

Supply Voltage-Max (Vsup) :

1.89V

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Connectivity :

CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB

Terminal Form :

Gull wing

RAM (bytes) :

57344

Speed :

125MHz

Length :

20mm

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Width :

20mm

Data Converter :

A/D 24x10b

PWM Channels :

yes

Terminal Pitch :

0.5mm

Qualification Status :

Not Qualified

JESD-30 Code :

S-PQFP-G144

Package / Case :

144-LQFP

External Data Bus Width :

32

Has ADC :

yes

Program Memory Size :

256KB 256K x 8

Supply Voltage-Min (Vsup) :

1.71V

Oscillator Type :

Internal