LPC2470FET208,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

HTS Code :

8542.31.00.01

Number of Terminations :

208

Has ADC :

yes

Published :

2003

Mounting Type :

Surface Mount

Supply Voltage-Min (Vsup) :

3V

JESD-30 Code :

S-PBGA-B208

ECCN Code :

EAR99

Qualification Status :

Not Qualified

Core Processor :

ARM7®

Series :

LPC2400

Peak Reflow Temperature (Cel) :

260

Base Part Number :

LPC2470

Factory Lead Time :

12 Weeks

Data Converter :

A/D 8x10b; D/A 1x10b

Moisture Sensitivity Level (MSL) :

2 (1 Year)

ROM (words) :

0

JESD-609 Code :

e1

Operating Temperature :

-40°C~85°C TA

Oscillator Type :

Internal

Address Bus Width :

24

PWM Channels :

yes

Height Seated (Max) :

1.2mm

Packaging :

Tray

Package / Case :

208-TFBGA

Terminal Pitch :

0.8mm

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Power Supplies :

3.3V

Clock Frequency :

24MHz

DAC Channels :

yes

Core Size :

16/32-Bit

RAM Size :

98K x 8

Terminal Position :

BOTTOM

RoHS Status :

ROHS3 Compliant

Speed :

72MHz

External Data Bus Width :

32

Bit Size :

32

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

DMA Channels :

yes

Program Memory Type :

ROMless

Terminal Form :

Ball

Voltage - Supply (Vcc/Vdd) :

3V~3.6V

Supply Voltage-Max (Vsup) :

3.6V

Number of I/O :

160

Pin Count :

208

Peripherals :

Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT

Length :

15mm

Width :

15mm

Surface Mount :

yes

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

Supply Voltage :

3.3V

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

ROM Programmability :

MROM