LPC2470FBD208,551

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Mfr.Part #
LPC2470FBD208,551
Manufacturer
NXP Semiconductors
Package / Case
208-LQFP
Datasheet
Download
Description
IC MCU 16/32BIT ROMLESS 208LQFP
Stock
4,318
In Stock :
4,318

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Core Size :
16/32-Bit
Voltage - Supply (Vcc/Vdd) :
3V~3.6V
JESD-609 Code :
e3
Base Part Number :
LPC2470
Peripherals :
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Package / Case :
208-LQFP
Pin Count :
208
Data Converter :
A/D 8x10b; D/A 1x10b
Core Processor :
ARM7®
Operating Temperature :
-40°C~85°C TA
Supply Voltage-Min (Vsup) :
3V
JESD-30 Code :
S-PQFP-G208
Supply Voltage :
3.3V
Power Supplies :
3.3V
Address Bus Width :
24
Published :
2003
Terminal Form :
Gull wing
Supply Voltage-Max (Vsup) :
3.6V
Oscillator Type :
Internal
RAM Size :
98K x 8
Connectivity :
CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Number of Terminations :
208
Width :
28mm
Program Memory Type :
ROMless
DMA Channels :
yes
Moisture Sensitivity Level (MSL) :
2 (1 Year)
Mounting Type :
Surface Mount
Speed :
72MHz
Terminal Finish :
Tin (Sn)
Qualification Status :
Not Qualified
Height Seated (Max) :
1.6mm
ROM (words) :
0
Terminal Position :
QUAD
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Surface Mount :
yes
Factory Lead Time :
12 Weeks
DAC Channels :
yes
Has ADC :
yes
Bit Size :
32
External Data Bus Width :
32
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Packaging :
Tray
ECCN Code :
EAR99
RoHS Status :
ROHS3 Compliant
ROM Programmability :
MROM
Number of I/O :
160
Clock Frequency :
24MHz
Peak Reflow Temperature (Cel) :
260
Length :
28mm
Series :
LPC2400
Terminal Pitch :
0.5mm
PWM Channels :
yes
HTS Code :
8542.31.00.01
Introducing Microcontrollers NXP Semiconductors LPC2470FBD208,551 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LPC2470, Package / Case:208-LQFP, Operating Temperature:-40°C~85°C TA, Number of Terminations:208, Mounting Type:Surface Mount, LPC2470FBD208,551 pinout, LPC2470FBD208,551 datasheet PDF, LPC2470FBD208,551 amp .Beyond Microcontrollers NXP Semiconductors LPC2470FBD208,551 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC2470FBD208,551


Microcontrollers NXP Semiconductors LPC2470FBD208,551 Overview

The Microcontrollers NXP Semiconductors LPC2470FBD208,551 is a highly capable ROMless 16/32-bit microcontroller that offers exceptional flexibility and performance suited to advanced embedded applications. This IC from NXP Semiconductors is designed without onboard ROM, allowing designers to integrate custom firmware and software solutions that meet specific system requirements. With its robust packaging in a 208LQFP format, it provides ample I/O options and scalability, making it an ideal choice for industries looking to optimize their electronic systems with efficient and reliable microcontroller solutions.

LPC2470FBD208,551 Features

The LPC2470FBD208,551 microcontroller integrates a variety of features that enhance its usability and functionality in complex electronic setups. Key features include a 16/32-bit ARM7TDMI-S processor, extensive I/O capabilities through its 208 leads, and a wide range of connectivity options including USB 2.0 Full Speed, CAN, and Ethernet. Additionally, it supports multiple serial communication interfaces, making it highly versatile for various data exchange requirements.

LPC2470FBD208,551 Applications

  • Industrial Automation: In industrial settings, this MCU manages complex processes and machinery with precision, facilitating improved process control and automation capabilities.
  • Medical Devices: It can be employed in medical diagnostic equipment and patient monitoring systems, offering reliable performance essential for critical healthcare operations.
  • Networking: Suitable for networked devices, it supports robust connectivity features that enable reliable data transfer and communication across network infrastructure.
  • Automotive: The MCU serves crucial roles in automotive applications, controlling various electronic components within vehicles to enhance functionality and safety.
  • Consumer Electronics: It is also used in high-demand consumer electronics, providing core processing capabilities for devices such as gaming consoles and smart home systems.
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