LPC2362FBD100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Published :

2003

Width :

14mm

Voltage - Supply (Vcc/Vdd) :

3V~3.6V

Surface Mount :

yes

Terminal Form :

Gull wing

HTS Code :

8542.31.00.01

RoHS Status :

ROHS3 Compliant

ECCN Code :

EAR99

Factory Lead Time :

12 Weeks

Height Seated (Max) :

1.6mm

Speed :

72MHz

Operating Temperature :

-40°C~85°C TA

JESD-609 Code :

e3

Length :

14mm

Supply Voltage-Min (Vsup) :

3V

Supply Current-Max :

100mA

JESD-30 Code :

S-PQFP-G100

ROM (words) :

131072

Core Processor :

ARM7®

RAM Size :

58K x 8

Connectivity :

CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG

DMA Channels :

yes

Qualification Status :

Not Qualified

PWM Channels :

yes

Peak Reflow Temperature (Cel) :

260

Series :

LPC2300

Power Supplies :

3.3V

Pin Count :

100

Oscillator Type :

Internal

Number of Terminations :

100

Clock Frequency :

25MHz

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

DAC Channels :

yes

Terminal Finish :

Tin (Sn)

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Peripherals :

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

Program Memory Size :

128KB 128K x 8

Packaging :

Tray

Supply Voltage :

3.3V

Has ADC :

yes

Terminal Position :

QUAD

Program Memory Type :

Flash

Mounting Type :

Surface Mount

Data Converter :

A/D 6x10b; D/A 1x10b

Number of I/O :

70

Core Size :

16/32-Bit

Package / Case :

100-LQFP

Base Part Number :

LPC2362

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Supply Voltage-Max (Vsup) :

3.6V

Bit Size :

32

Terminal Pitch :

0.5mm