LPC2292FBD144,551

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Mfr.Part #
LPC2292FBD144,551
Manufacturer
NXP Semiconductors
Package / Case
144-LQFP
Datasheet
Download
Description
IC MCU 16/32B 256KB FLSH 144LQFP
Stock
41,613
In Stock :
41,613

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Supply Voltage-Min (Vsup) :
1.65V
Moisture Sensitivity Level (MSL) :
2 (1 Year)
JESD-609 Code :
e3
Terminal Finish :
MATTE TIN
Width :
20mm
Core Processor :
ARM7®
Base Part Number :
LPC2292
Address Bus Width :
24
Oscillator Type :
Internal
RAM Size :
16K x 8
Pin Count :
144
Package / Case :
144-LQFP
Speed :
60MHz
Bit Size :
32
DMA Channels :
No
Terminal Pitch :
0.5mm
Packaging :
Tray
Connectivity :
CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Length :
20mm
External Data Bus Width :
32
Height Seated (Max) :
1.6mm
Series :
LPC2200
Clock Frequency :
50MHz
Additional Feature :
ALSO REQUIRES 3.3V SUPPLY
Core Size :
16/32-Bit
PWM Channels :
yes
Peripherals :
POR, PWM, WDT
Terminal Form :
Gull wing
DAC Channels :
No
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
ECCN Code :
3A001.A.3
Operating Temperature :
-40°C~85°C TA
Published :
2003
Data Converter :
A/D 8x10b
Number of Terminations :
144
RoHS Status :
ROHS3 Compliant
Number of I/O :
112
Supply Voltage-Max (Vsup) :
1.95V
Terminal Position :
QUAD
Qualification Status :
Not Qualified
Program Memory Size :
256KB 256K x 8
Mounting Type :
Surface Mount
HTS Code :
8542.31.00.01
Supply Voltage :
1.8V
Has ADC :
yes
Voltage - Supply (Vcc/Vdd) :
1.65V~3.6V
Surface Mount :
yes
JESD-30 Code :
S-PQFP-G144
Program Memory Type :
Flash
Datasheets
LPC2292FBD144,551
Introducing Microcontrollers NXP Semiconductors LPC2292FBD144,551 from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LPC2292, Package / Case:144-LQFP, Operating Temperature:-40°C~85°C TA, Number of Terminations:144, Mounting Type:Surface Mount, LPC2292FBD144,551 pinout, LPC2292FBD144,551 datasheet PDF, LPC2292FBD144,551 amp .Beyond Microcontrollers NXP Semiconductors LPC2292FBD144,551 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC2292FBD144,551


Microcontrollers NXP Semiconductors LPC2292FBD144,551 Overview

Introducing the LPC2292FBD144,551 from NXP Semiconductors, an advanced microcontroller that stands out in the dynamic market of embedded systems. This high-performance, versatile MCU is designed to meet the complex needs of modern electronic applications, offering a robust mix of processing power, memory options, and connectivity. Tailored for engineers and developers seeking a reliable and scalable solution, the LPC2292FBD144,551 embodies efficiency and adaptability in its feature-rich architecture. It is particularly well-suited for applications requiring a sophisticated interface and varied I/O operations, making it a prime choice for innovating next-generation technology products.

LPC2292FBD144,551 Features

The LPC2292FBD144,551 microcontroller features a 16/32-bit ARM7TDMI-S core, providing excellent computational speed and efficiency. With 256KB of onboard flash memory, it allows ample space for application code and data storage. The MCU also supports a wide range of communication protocols including multiple serial interfaces, enhancing its utility in complex digital systems. Its 144-LQFP package ensures a compact footprint while allowing for sufficient I/O ports and external interfacing, critical for multifaceted applications and devices.

LPC2292FBD144,551 Applications

  • Industrial Automation: Utilizes its robust processing capabilities and multiple I/O options to manage and control machinery and production processes efficiently.
  • Automotive Systems: Employs advanced interfacing features to integrate into vehicle diagnostics, infotainment, and advanced driver assistance systems (ADAS).
  • Home Automation: Leverages its connectivity features for smart home devices, enhancing user control and energy management.
  • Medical Devices: Takes advantage of its precision and reliability in monitoring systems and wearable health technology.
  • Telecommunications: Supports communication protocols that are essential for networking equipment and infrastructure.
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