LPC18S57JBD208

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Clock Frequency :

25MHz

RAM Size :

136K x 8

Operating Temperature :

-40°C~105°C TA

External Data Bus Width :

30

Published :

2010

Program Memory Size :

1MB 1M x 8

Supply Voltage-Min (Vsup) :

2.4V

Mounting Type :

Surface Mount

Data Converter :

A/D 8x10b; D/A 1x10b

PWM Channels :

yes

Oscillator Type :

Internal

Core Size :

32-Bit

Terminal Form :

Gull wing

Address Bus Width :

26

Packaging :

Tray

Speed :

180MHz

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Peripherals :

Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT

Surface Mount :

yes

Number of Terminations :

208

Terminal Pitch :

0.5mm

Connectivity :

CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB

RoHS Status :

ROHS3 Compliant

Bit Size :

32

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Factory Lead Time :

12 Weeks

Has ADC :

yes

Width :

28mm

Terminal Position :

QUAD

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Core Processor :

ARM® Cortex®-M3

Program Memory Type :

Flash

Voltage - Supply (Vcc/Vdd) :

2.2V~3.6V

DMA Channels :

yes

Supply Voltage-Max (Vsup) :

3.6V

Pin Count :

208

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Supply Voltage :

3.3V

Series :

LPC18xx

Length :

28mm

Package / Case :

208-LQFP

Number of I/O :

142