LPC18S50FET256,551

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Mfr.Part #
LPC18S50FET256,551
Manufacturer
NXP Semiconductors
Package / Case
256-LBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 256LBGA
Stock
26,377
In Stock :
26,377

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Series :
LPC18xx
Packaging :
Tray
Program Memory Type :
ROMless
Peripherals :
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Data Converter :
A/D 8x10b; D/A 1x10b
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Voltage - Supply (Vcc/Vdd) :
2.2V~3.6V
RoHS Status :
ROHS3 Compliant
RAM Size :
200K x 8
Connectivity :
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Factory Lead Time :
12 Weeks
Published :
2010
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Speed :
180MHz
Pin Count :
256
Core Processor :
ARM® Cortex®-M3
Package / Case :
256-LBGA
Oscillator Type :
Internal
Core Size :
32-Bit
Mounting Type :
Surface Mount
Operating Temperature :
-40°C~85°C TA
Number of I/O :
164
Introducing Microcontrollers NXP Semiconductors LPC18S50FET256,551 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Mounting Type:Surface Mount, Operating Temperature:-40°C~85°C TA, LPC18S50FET256,551 pinout, LPC18S50FET256,551 datasheet PDF, LPC18S50FET256,551 amp .Beyond Microcontrollers NXP Semiconductors LPC18S50FET256,551 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC18S50FET256,551


Microcontrollers NXP Semiconductors LPC18S50FET256,551 Overview

The LPC18S50FET256,551 from NXP Semiconductors is a high-performance microcontroller unit (MCU) tailored for advanced applications that demand reliable, quick processing capabilities without onboard memory. This 32-bit MCU is part of the LPC family, known for their efficiency and versatility in complex embedded systems. Designed to operate without ROM, the LPC18S50FET256,551 allows designers to customize memory configurations to meet specific system requirements, enhancing both flexibility and performance. The incorporation of a 256-ball low-profile ball grid array (LBGA) package ensures minimized space occupation while maximizing functionality, a critical factor in modern electronic design.

LPC18S50FET256,551 Features

The LPC18S50FET256,551 stands out with its ROM-less architecture, allowing for extensive customization in memory usage which can be critical for specialized applications. The MCU operates on a powerful 32-bit architecture that provides robust support for intensive computing tasks. This microcontroller supports multiple high-speed communication protocols, making it an ideal choice for applications requiring rapid and flexible connectivity solutions.

LPC18S50FET256,551 Applications

  • Industrial Automation: In industrial settings, the LPC18S50FET256,551 can manage operational technologies, sensor data, and actuator controls, optimizing manufacturing processes.
  • Medical Devices: Used in medical diagnostic equipment, this MCU processes complex algorithms quickly to deliver fast and reliable results, which is essential for patient care.
  • Automotive Systems: Suitable for in-vehicle networks, the LPC18S50FET256,551 handles communication between various electronic devices within cars, enhancing the automotive safety and entertainment systems.
  • Consumer Electronics: In devices such as smart home technologies, this microcontroller integrates functionalities for managing multiple device communications within a network, ensuring efficient operation.
  • Communication Infrastructure: It plays a critical role in the management and operation of communication technology systems, providing the necessary processing power for network control and data handling.
This HTML content provides a detailed overview, feature summary, and practical applications of the LPC18S50FET256,551, presenting it as an essential component for various high-demand electronic environments.
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