LPC1857FET256,551
- Mfr.Part #
- LPC1857FET256,551
- Manufacturer
- NXP Semiconductors
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC MCU 32BIT 1MB FLASH 256LBGA
- Stock
- 7,225
- In Stock :
- 7,225
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- Manufacturer :
- NXP Semiconductors
- Product Category :
- Microcontrollers
- Operating Temperature :
- -40°C~85°C TA
- Peripherals :
- Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
- Package / Case :
- 256-LBGA
- Supply Voltage :
- 3.3V
- Connectivity :
- I²C, IrDA, LINbus, SPI, UART/USART
- Peak Reflow Temperature (Cel) :
- 260
- Oscillator Type :
- Internal
- Length :
- 17mm
- Factory Lead Time :
- 12 Weeks
- PWM Channels :
- yes
- Source Url Status Check Date :
- 2013-06-14 00:00:00
- Width :
- 17mm
- Packaging :
- Tray
- Core Processor :
- ARM® Cortex®-M3
- Number of I/O :
- 164
- Pin Count :
- 256
- uPs/uCs/Peripheral ICs Type :
- MICROCONTROLLER, RISC
- Number of Terminations :
- 256
- Terminal Position :
- BOTTOM
- Speed :
- 180MHz
- Published :
- 2010
- Core Size :
- 32-Bit
- DMA Channels :
- yes
- Clock Frequency :
- 25MHz
- RoHS Status :
- ROHS3 Compliant
- EEPROM Size :
- 16K x 8
- CPU Family :
- CORTEX-M3
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Series :
- LPC18xx
- Terminal Pitch :
- 1mm
- External Data Bus Width :
- 32
- JESD-609 Code :
- e1
- JESD-30 Code :
- S-PBGA-B256
- Mounting Type :
- Surface Mount
- Surface Mount :
- yes
- Terminal Form :
- Ball
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Program Memory Type :
- Flash
- DAC Channels :
- yes
- Height Seated (Max) :
- 1.55mm
- Has ADC :
- yes
- Data Converter :
- A/D 8x10b; D/A 1x10b
- Supply Voltage-Max (Vsup) :
- 3.6V
- Voltage - Supply (Vcc/Vdd) :
- 2.2V~3.6V
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- RAM Size :
- 136K x 8
- ROM (words) :
- 1048576
- Base Part Number :
- LPC1857
- Power Supplies :
- 2.5/3.3V
- Program Memory Size :
- 1MB 1M x 8
- Address Bus Width :
- 24
- Supply Voltage-Min (Vsup) :
- 2.2V
- Qualification Status :
- Not Qualified
- Bit Size :
- 32
- Datasheets
- LPC1857FET256,551

Microcontrollers NXP Semiconductors LPC1857FET256,551 Overview
The Microcontrollers NXP Semiconductors LPC1857FET256,551 is a high-performance microcontroller unit (MCU) designed to meet the demanding requirements of sophisticated embedded applications. This device leverages a powerful 32-bit ARM Cortex-M3 processor, which provides a perfect blend of energy efficiency and computational capability. The LPC1857FET256,551 features 1MB of flash memory and is packaged in a compact 256-LBGA, making it ideal for space-constrained applications that require robust control and connectivity features.
LPC1857FET256,551 Features
The LPC1857FET256,551 comes equipped with a vast array of features, making it suitable for a variety of complex electronic designs. Key features include:
- 32-bit ARM Cortex-M3 processor: Delivers powerful computational abilities while maintaining efficiency.
- 1MB flash memory: Provides ample space for application code and data storage.
- Enhanced connectivity options: Includes USB, CAN, and Ethernet interfaces for versatile connectivity.
- High-resolution ADCs and DACs: Ensure precise analog signal management for critical applications.
- Low power consumption: Optimized for energy-sensitive applications.
LPC1857FET256,551 Applications
- Industrial Automation: The robust processing capabilities and multiple I/O options make this MCU ideal for managing complex automation systems.
- Medical Devices: Its high reliability and precision ADCs/DACs support critical medical applications such as diagnostic equipment and patient monitoring systems.
- Networking Equipment: Equipped with Ethernet connectivity, this MCU is well-suited for networking gear like routers and switches where data integrity and processing speed are crucial.
- Automotive: The LPC1857FET256,551's CAN interface enables it to function effectively within automotive subsystems, facilitating vehicle communication networks.
- Consumer Electronics: Ideal for smart home devices and personal gadgets requiring efficient, high-speed processing and multiple connectivity options.
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