LPC1850FET256,551

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Mfr.Part #
LPC1850FET256,551
Manufacturer
NXP Semiconductors
Package / Case
256-LBGA
Datasheet
Download
Description
IC MCU 32BIT ROMLESS 256LBGA
Stock
846
In Stock :
846

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
Pin Count :
256
RoHS Status :
ROHS3 Compliant
JESD-30 Code :
S-PBGA-B256
Package / Case :
256-LBGA
Core Processor :
ARM® Cortex®-M3
Oscillator Type :
Internal
Published :
2010
DAC Channels :
yes
Operating Temperature :
-40°C~85°C TA
Terminal Form :
Ball
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Source Url Status Check Date :
2013-06-14 00:00:00
Surface Mount :
yes
Factory Lead Time :
12 Weeks
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Peripherals :
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Width :
17mm
Series :
LPC18xx
PWM Channels :
yes
Terminal Pitch :
1mm
Packaging :
Tray
Terminal Position :
BOTTOM
Bit Size :
32
Connectivity :
I²C, IrDA, LINbus, SPI, UART/USART
Supply Voltage :
3.3V
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Qualification Status :
Not Qualified
Supply Voltage-Min (Vsup) :
2.2V
External Data Bus Width :
32
Data Converter :
A/D 8x10b; D/A 1x10b
Mounting Type :
Surface Mount
Base Part Number :
LPC1850
Address Bus Width :
24
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
ROM Programmability :
Flash
Number of Terminations :
256
Number of I/O :
164
CPU Family :
CORTEX-M3
DMA Channels :
yes
Length :
17mm
Power Supplies :
2.5/3.3V
Core Size :
32-Bit
Speed :
180MHz
Height Seated (Max) :
1.55mm
Program Memory Type :
ROMless
Has ADC :
yes
Supply Voltage-Max (Vsup) :
3.6V
JESD-609 Code :
e1
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
RAM Size :
200K x 8
Voltage - Supply (Vcc/Vdd) :
2.2V~3.6V
ROM (words) :
65536
Clock Frequency :
25MHz
Datasheets
LPC1850FET256,551
Introducing Microcontrollers NXP Semiconductors LPC1850FET256,551 from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Operating Temperature:-40°C~85°C TA, Mounting Type:Surface Mount, Base Part Number:LPC1850, Number of Terminations:256, LPC1850FET256,551 pinout, LPC1850FET256,551 datasheet PDF, LPC1850FET256,551 amp .Beyond Microcontrollers NXP Semiconductors LPC1850FET256,551 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC1850FET256,551


Microcontrollers NXP Semiconductors LPC1850FET256,551 Overview

The Microcontrollers NXP Semiconductors LPC1850FET256,551 is a state-of-the-art microcontroller unit (MCU) designed to meet the high demands of sophisticated embedded applications. This ROMless 32-bit MCU boasts high performance and flexibility, making it an ideal choice for developers seeking a robust platform for their next-generation products. With its advanced architecture, this MCU offers efficient processing capabilities suitable for complex algorithms and multitasking environments.

LPC1850FET256,551 Features

This microcontroller from NXP Semiconductors features a powerful ARM Cortex-M3 processor, which provides enhanced computational speed and improved efficiency in data handling. The lack of onboard ROM encourages a flexible design approach, allowing users to tailor memory configurations according to specific project requirements. Its 256-pin Low-profile Ball Grid Array (LBGA) package ensures compact integration and reliability in space-constrained applications.

LPC1850FET256,551 Applications

  • Industrial Automation: The LPC1850FET256,551 can be integrated into control systems for real-time processing of machine operations, enhancing precision and productivity in manufacturing environments.
  • Medical Devices: This MCU is well-suited for medical monitoring systems, where precise data processing and real-time response are crucial for patient care and diagnostic equipment.
  • Automotive Applications: It can be used in automotive control systems, providing the processing power needed for engine management systems and advanced driver-assistance systems (ADAS).
  • Consumer Electronics: Ideal for high-performance consumer electronics, such as gaming consoles and smart home devices, where its processing capabilities enable rich user interfaces and connectivity options.
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