LPC1830FET100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Terminal Form :

Ball

Height Seated (Max) :

1.2mm

Surface Mount :

yes

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Series :

LPC18xx

Power Supplies :

2.5/3.3V

Number of I/O :

49

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

Package / Case :

100-TFBGA

Peripherals :

Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT

Terminal Pitch :

0.8mm

ROM Programmability :

Flash

RoHS Status :

ROHS3 Compliant

Bit Size :

32

Supply Voltage-Max (Vsup) :

3.6V

Core Size :

32-Bit

Factory Lead Time :

12 Weeks

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Terminal Position :

BOTTOM

Supply Voltage-Min (Vsup) :

2.2V

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Terminal Finish :

Tin/Silver/Copper (Sn/Ag/Cu)

Voltage - Supply (Vcc/Vdd) :

2.2V~3.6V

Program Memory Type :

ROMless

JESD-609 Code :

e1

ROM (words) :

65536

Published :

2010

CPU Family :

CORTEX-M3

Length :

9mm

Clock Frequency :

25MHz

Pin Count :

100

Width :

9mm

DAC Channels :

yes

JESD-30 Code :

S-PBGA-B100

External Data Bus Width :

32

Data Converter :

A/D 8x10b; D/A 1x10b

Oscillator Type :

Internal

DMA Channels :

yes

RAM Size :

200K x 8

Supply Voltage :

3.3V

Source Url Status Check Date :

2013-06-14 00:00:00

Speed :

180MHz

Number of Terminations :

100

Has ADC :

yes

Mounting Type :

Surface Mount

Core Processor :

ARM® Cortex®-M3

Operating Temperature :

-40°C~85°C TA

Base Part Number :

LPC1830

Packaging :

Tray

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Qualification Status :

Not Qualified

Address Bus Width :

24

PWM Channels :

No