LPC1766FBD100,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

Power Supplies :

2.5/3.33/3.3V

Bit Size :

32

Number of I/O :

70

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Terminal Finish :

Tin (Sn)

DAC Channels :

yes

Series :

LPC17xx

Core Processor :

ARM® Cortex®-M3

Peripherals :

Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT

Supply Voltage-Max (Vsup) :

3.6V

PWM Channels :

yes

CPU Family :

ARM7

Clock Frequency :

25MHz

Terminal Pitch :

0.5mm

Qualification Status :

Not Qualified

Program Memory Size :

256KB 256K x 8

ROM (words) :

262144

ECCN Code :

EAR99

Connectivity :

CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART

HTS Code :

8542.31.00.01

Terminal Position :

QUAD

Has ADC :

yes

JESD-609 Code :

e3

Package / Case :

100-LQFP

Published :

2009

Factory Lead Time :

12 Weeks

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

Supply Voltage-Min (Vsup) :

2.4V

Pin Count :

100

Peak Reflow Temperature (Cel) :

260

Operating Temperature :

-40°C~85°C TA

Terminal Form :

Gull wing

Length :

14mm

Time@Peak Reflow Temperature-Max (s) :

30

Speed :

100MHz

JESD-30 Code :

S-PQFP-G100

Width :

14mm

DMA Channels :

yes

Number of Terminations :

100

Oscillator Type :

Internal

RoHS Status :

ROHS3 Compliant

Height Seated (Max) :

1.6mm

RAM Size :

64K x 8

Packaging :

Tray

Data Converter :

A/D 8x12b; D/A 1x10b

Core Size :

32-Bit

Mounting Type :

Surface Mount

Supply Voltage :

3.3V

Voltage - Supply (Vcc/Vdd) :

2.4V~3.6V

Program Memory Type :

Flash

Base Part Number :

LPC1766

Surface Mount :

yes