LPC1316FHN33,551

Manufacturer :

NXP Semiconductors

Product Category :

Microcontrollers

EEPROM Size :

4K x 8

Power Supplies :

3.3V

Operating Temperature :

-40°C~85°C TA

Factory Lead Time :

12 Weeks

Pin Count :

32

Core Size :

32-Bit

Terminal Position :

QUAD

Mounting Type :

Surface Mount

Published :

2010

Peripherals :

Brown-out Detect/Reset, POR, WDT

DMA Channels :

No

Connectivity :

I²C, IrDA, LINbus, SPI, UART/USART

Package / Case :

32-VQFN Exposed Pad

Series :

LPC13xx

Height Seated (Max) :

1mm

ROM (words) :

49152

Has ADC :

yes

Peak Reflow Temperature (Cel) :

NOT SPECIFIED

RoHS Status :

ROHS3 Compliant

PWM Channels :

No

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

Packaging :

Tray

Base Part Number :

LPC1316

Bit Size :

32

uPs/uCs/Peripheral ICs Type :

MICROCONTROLLER, RISC

DAC Channels :

No

Surface Mount :

yes

Supply Voltage-Min (Vsup) :

2V

Voltage - Supply (Vcc/Vdd) :

2V~3.6V

Clock Frequency :

25MHz

JESD-30 Code :

S-PQCC-N33

Terminal Pitch :

0.65mm

Number of I/O :

26

RAM Size :

8K x 8

Source Url Status Check Date :

2013-06-14 00:00:00

Oscillator Type :

Internal

CPU Family :

CORTEX-M3

Core Processor :

ARM® Cortex®-M3

Terminal Form :

NO LEAD

Number of Terminations :

33

Program Memory Type :

Flash

Length :

7mm

Moisture Sensitivity Level (MSL) :

3 (168 Hours)

Supply Voltage-Max (Vsup) :

3.6V

Qualification Status :

Not Qualified

Program Memory Size :

48KB 48K x 8

Speed :

72MHz

Supply Voltage :

3.3V

Width :

7mm

Data Converter :

A/D 8x12b