LPC1311FHN33,551

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Mfr.Part #
LPC1311FHN33,551
Manufacturer
NXP Semiconductors
Package / Case
32-VQFN Exposed Pad
Datasheet
Download
Description
IC MCU 32BIT 8KB FLASH 32HVQFN
Stock
6,545
In Stock :
6,545

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
JESD-609 Code :
e4
Terminal Finish :
Nickel/Palladium/Gold (Ni/Pd/Au)
Number of Terminations :
33
Peak Reflow Temperature (Cel) :
260
Clock Frequency :
25MHz
Supply Voltage :
3.3V
CPU Family :
ARM7
Packaging :
Tray
Supply Voltage-Min (Vsup) :
2V
ROM (words) :
8192
Qualification Status :
Not Qualified
Power Supplies :
3.3V
Number of I/O :
28
Supply Voltage-Max (Vsup) :
3.6V
Peripherals :
Brown-out Detect/Reset, POR, WDT
Length :
7mm
ECCN Code :
EAR99
Width :
7mm
Bit Size :
32
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Oscillator Type :
Internal
Operating Temperature :
-40°C~85°C TA
Package / Case :
32-VQFN Exposed Pad
RoHS Status :
ROHS3 Compliant
HTS Code :
8542.31.00.01
Data Converter :
A/D 8x10b
Terminal Position :
QUAD
PWM Channels :
No
Has ADC :
yes
DAC Channels :
No
Series :
LPC13xx
Connectivity :
I²C, IrDA, LINbus, SPI, UART/USART
DMA Channels :
No
Height Seated (Max) :
1mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Speed :
72MHz
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Program Memory Type :
Flash
Terminal Pitch :
0.65mm
Voltage - Supply (Vcc/Vdd) :
2V~3.6V
Core Processor :
ARM® Cortex®-M3
Core Size :
32-Bit
Program Memory Size :
8KB 8K x 8
On Chip Program ROM Width :
8
Pin Count :
32
Terminal Form :
NO LEAD
Mounting Type :
Surface Mount
Base Part Number :
LPC1311
RAM Size :
4K x 8
Published :
2006
Factory Lead Time :
12 Weeks
JESD-30 Code :
S-PQCC-N33
Surface Mount :
yes
Datasheets
LPC1311FHN33,551
Introducing Microcontrollers NXP Semiconductors LPC1311FHN33,551 from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:33, Operating Temperature:-40°C~85°C TA, Package / Case:32-VQFN Exposed Pad, Mounting Type:Surface Mount, Base Part Number:LPC1311, LPC1311FHN33,551 pinout, LPC1311FHN33,551 datasheet PDF, LPC1311FHN33,551 amp .Beyond Microcontrollers NXP Semiconductors LPC1311FHN33,551 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC1311FHN33,551


Microcontrollers NXP Semiconductors LPC1311FHN33,551 Overview

The LPC1311FHN33,551 from NXP Semiconductors represents a robust and versatile microcontroller solution, engineered to meet the demanding requirements of sophisticated electronic systems. This microcontroller is part of the LPC1300 series, renowned for their cost efficiency and high performance. The LPC1311FHN33,551 specifically boasts a powerful ARM Cortex-M3 processor, which operates at a maximum frequency of 72 MHz, providing the computational power needed for complex algorithms and signal processing. The integration of 8KB of flash memory and 4KB of RAM ensures ample space for application code and data, making it an ideal choice for a wide range of industrial and commercial applications.

LPC1311FHN33,551 Features

The LPC1311FHN33,551 microcontroller offers a range of features designed for versatility and ease of use in embedded systems. Key features include 32-bit ARM Cortex-M3 architecture, 8KB of on-chip flash memory, 4KB of SRAM, and a variety of digital and analog peripherals. These features are complemented by its low power consumption, extensive interrupt capabilities, and support for multiple communication protocols including UART, I2C, and SPI, making it highly suitable for interfacing with other digital systems.

LPC1311FHN33,551 Applications

  • Industrial Automation: Utilized in control systems for automating processes, this MCU can manage multiple sensors and actuators due to its robust GPIO capabilities and real-time processing speed.
  • Consumer Electronics: Acts as a control unit in devices such as gaming consoles and smart appliances, providing responsive user interfaces and connectivity features.
  • Automotive Applications: Suitable for non-safety critical tasks within automotive electronics, such as in-cabin entertainment and environmental controls, thanks to its reliable performance and support for serial communication.
  • Internet of Things (IoT): Empowers smart IoT devices, enabling wireless communication and data handling capabilities necessary for smart homes and cities.
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