LPC1311FHN33/01,55

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Mfr.Part #
LPC1311FHN33/01,55
Manufacturer
NXP Semiconductors
Package / Case
32-VQFN Exposed Pad
Datasheet
Download
Description
IC MCU 32BIT 8KB FLASH 32HVQFN
Stock
59
In Stock :
59

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Manufacturer :
NXP Semiconductors
Product Category :
Microcontrollers
JESD-609 Code :
e3
Core Processor :
ARM® Cortex®-M3
Number of I/O :
28
HTS Code :
8542.31.00.01
Length :
7mm
Supply Voltage-Min (Vsup) :
2V
Program Memory Type :
Flash
Bit Size :
32
Pin Count :
32
Clock Frequency :
25MHz
CPU Family :
CORTEX-M3
Qualification Status :
Not Qualified
Terminal Form :
NO LEAD
Oscillator Type :
Internal
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Supply Voltage-Max (Vsup) :
3.6V
Terminal Position :
QUAD
Operating Temperature :
-40°C~85°C TA
Surface Mount :
yes
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Peak Reflow Temperature (Cel) :
260
Has ADC :
yes
Connectivity :
I²C, IrDA, LINbus, SPI, UART/USART
PWM Channels :
No
Peripherals :
Brown-out Detect/Reset, POR, WDT
Package / Case :
32-VQFN Exposed Pad
Series :
LPC13xx
Published :
2009
Program Memory Size :
8KB 8K x 8
DAC Channels :
No
RoHS Status :
ROHS3 Compliant
JESD-30 Code :
S-PQCC-N33
Packaging :
Tray
Power Supplies :
3.3V
Mounting Type :
Surface Mount
Factory Lead Time :
12 Weeks
DMA Channels :
No
Core Size :
32-Bit
Width :
7mm
ROM (words) :
8192
ECCN Code :
EAR99
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER
Terminal Finish :
Matte Tin (Sn)
Number of Terminations :
33
RAM Size :
4K x 8
Data Converter :
A/D 8x10b
Base Part Number :
LPC1311
Speed :
72MHz
Height Seated (Max) :
1mm
Terminal Pitch :
0.65mm
Supply Voltage :
3.3V
On Chip Program ROM Width :
8
Voltage - Supply (Vcc/Vdd) :
2V~3.6V
Introducing Microcontrollers NXP Semiconductors LPC1311FHN33/01,55 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Package / Case:32-VQFN Exposed Pad, Mounting Type:Surface Mount, Number of Terminations:33, Base Part Number:LPC1311, LPC1311FHN33/01,55 pinout, LPC1311FHN33/01,55 datasheet PDF, LPC1311FHN33/01,55 amp .Beyond Microcontrollers NXP Semiconductors LPC1311FHN33/01,55 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

NXP Semiconductors LPC1311FHN33/01,55


Microcontrollers NXP Semiconductors LPC1311FHN33/01,55 Overview

The LPC1311FHN33/01,55 by NXP Semiconductors is a cutting-edge microcontroller designed for robust performance in demanding applications. Featuring a 32-bit ARM Cortex-M3 processor, this IC is optimized for efficiency and power management, making it ideal for advanced embedded systems. Its compact 32HVQFN package allows for a streamlined integration in space-constrained environments. The incorporation of 8KB of flash memory enhances its capability to handle complex operations and software updates. This microcontroller is a reliable choice for developers looking for a balance of performance, power consumption, and cost, emphasizing the key benefits of the Microcontrollers NXP Semiconductors LPC1311FHN33/01,55.

LPC1311FHN33/01,55 Features

  • 32-bit ARM Cortex-M3 processor: Offers high-performance computing power suitable for a wide range of applications.
  • 8KB of flash memory: Provides ample space for firmware and application code, which is critical for future upgrades and maintenance.
  • Compact 32HVQFN package: Ensures easy integration into space-sensitive applications without compromising functionality.
  • Low power consumption: Ideal for battery-operated devices, enhancing the overall efficiency and usability of the product.
  • Wide range of operating temperatures: Suitable for use in varied environmental conditions, enhancing its versatility.

LPC1311FHN33/01,55 Applications

  • Industrial Automation: Can be used in control systems for sensors and actuators, providing reliable processing capabilities for real-time operations.
  • Consumer Electronics: Ideal for use in smart appliances, enhancing user interfaces and connectivity with efficient processing speed.
  • Automotive Applications: Suitable for in-vehicle systems, offering robust performance in environments that require durability and operational stability.
  • Internet of Things (IoT): Powers various IoT devices, enabling smart home and industrial solutions with its efficient power usage and compact footprint.
  • Portable Medical Devices: Supports the demands of medical applications requiring compact, power-efficient, and reliable computing solutions.
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