LM3S6610-IBZ25-A2

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Mfr.Part #
LM3S6610-IBZ25-A2
Manufacturer
Texas Instruments
Package / Case
108-LFBGA
Datasheet
Download
Description
IC MCU 32BIT 128KB FLASH 108BGA
Stock
44,957
In Stock :
44,957

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Manufacturer :
Texas Instruments
Product Category :
Microcontrollers
Number of I/O :
46
Interface :
Ethernet, I2C, IrDA, SPI, UART, USART
Bit Size :
32
Voltage - Supply (Vcc/Vdd) :
2.25V~2.75V
Operating Temperature :
-40°C~85°C TA
Length :
10mm
Core Size :
32-Bit
Program Memory Size :
128KB 128K x 8
Number of Timers/Counters :
6
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
uPs/uCs/Peripheral ICs Type :
MICROCONTROLLER, RISC
Radiation Hardening :
No
Oscillator Type :
Internal
RAM Size :
32K x 8
Core Processor :
ARM® Cortex®-M3
Peripherals :
Brown-out Detect/Reset, POR, PWM, WDT
Terminal Position :
BOTTOM
Operating Supply Voltage :
3.3V
Supply Voltage-Max (Vsup) :
2.75V
Connectivity :
Ethernet, I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Memory Size :
128kB
Packaging :
Tray
Number of ADC Channels :
0
Package / Case :
108-LFBGA
Data Bus Width :
32b
Base Part Number :
LM3S6610
Mounting Type :
Surface Mount
Pin Count :
108
DMA Channels :
No
Mount :
Surface Mount
Watchdog Timer :
yes
Series :
Stellaris® ARM® Cortex®-M3S 6000
Number of UART Channels :
3
Terminal Form :
Ball
Frequency :
25MHz
JESD-609 Code :
e1
PWM Channels :
yes
Program Memory Type :
Flash
Number of Terminations :
108
Height Seated (Max) :
1.5mm
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Core Architecture :
ARM
Has ADC :
yes
RoHS Status :
ROHS3 Compliant
Peak Reflow Temperature (Cel) :
260
Lead Free :
Lead Free
Number of Pins :
108
Supply Voltage :
2.5V
Datasheets
LM3S6610-IBZ25-A2
Introducing Microcontrollers Texas Instruments LM3S6610-IBZ25-A2 from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~85°C TA, Package / Case:108-LFBGA, Base Part Number:LM3S6610, Mounting Type:Surface Mount, Number of Terminations:108, Number of Pins:108, LM3S6610-IBZ25-A2 pinout, LM3S6610-IBZ25-A2 datasheet PDF, LM3S6610-IBZ25-A2 amp .Beyond Microcontrollers Texas Instruments LM3S6610-IBZ25-A2 ,we also offer PIC16F506-I/SL, ATTINY44A-SSN, MS51FB9AE, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments LM3S6610-IBZ25-A2


Microcontrollers Texas Instruments LM3S6610-IBZ25-A2 Overview

The Microcontrollers Texas Instruments LM3S6610-IBZ25-A2 is a high-performance, 32-bit MCU designed specifically to meet the advanced requirements of embedded applications. This microcontroller integrates 128KB of flash memory and is packaged in a compact 108-BGA form factor, making it ideal for space-constrained environments. With its robust processing capabilities and flexible memory options, this MCU from Texas Instruments offers a scalable solution for a wide range of industrial and commercial applications, ensuring efficient operation and reliability.

LM3S6610-IBZ25-A2 Features

  • 32-bit ARM Cortex-M3 processor core for efficient processing and control.
  • 128KB of flash memory, providing substantial space for application code and data storage.
  • Low-power operation modes to ensure power efficiency in critical applications.
  • Comprehensive I/O support to handle a wide range of peripherals and interfaces.
  • Embedded system security features for secure data handling and operations.
  • 108-ball BGA package, optimized for minimized space usage in complex designs.

LM3S6610-IBZ25-A2 Applications

  • Industrial Automation: Employed in controlling machinery, sensors, and processes to improve reliability and efficiency in industrial settings.
  • Medical Devices: Used in medical diagnostic equipment where precision and reliability are critical.
  • Consumer Electronics: Integral in enhancing the functionality and user experience of consumer devices such as smart home systems and portable electronics.
  • Automotive Applications: Supports automotive subsystems for enhanced monitoring and control functionalities.
  • Communication Systems: Plays a key role in managing data communications and processing needs within networked devices.
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