LFXP6E-4FN256C

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Mfr.Part #
LFXP6E-4FN256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 188 I/O 256FBGA
Stock
40,530
In Stock :
40,530

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Number of Outputs :
188
Combinatorial Delay of a CLB-Max :
0.53 ns
Terminal Position :
BOTTOM
Number of Gates :
2
Base Part Number :
LFXP6
RAM Size :
9kB
Number of I/O :
188
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Form :
Ball
Width :
17mm
Voltage - Supply :
1.14V~1.26V
Package / Case :
256-BGA
Operating Supply Voltage :
1.2V
Packaging :
Tray
Qualification Status :
Not Qualified
Length :
17mm
Number of Logic Cells :
720
Terminal Pitch :
1mm
ECCN Code :
EAR99
Number of Logic Elements/Cells :
6000
Supply Voltage :
1.2V
Lead Free :
Lead Free
Mount :
Surface Mount
Operating Temperature :
0°C~85°C TJ
Peak Reflow Temperature (Cel) :
250
Max Frequency :
360MHz
Published :
2010
Number of CLBs :
720
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Number of Pins :
256
JESD-609 Code :
e1
Pbfree Code :
yes
Total RAM Bits :
73728
Mounting Type :
Surface Mount
Number of Logic Blocks (LABs) :
750
Pin Count :
256
Series :
XP
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
RoHS Status :
RoHS Compliant
Number of Terminations :
256
Memory Size :
11.9kB
Datasheets
LFXP6E-4FN256C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP6E-4FN256C from Chip IC,where excellence meets affordability. This product stands out with its Base Part Number:LFXP6, Package / Case:256-BGA, Operating Temperature:0°C~85°C TJ, Number of Pins:256, Mounting Type:Surface Mount, Number of Terminations:256, LFXP6E-4FN256C pinout, LFXP6E-4FN256C datasheet PDF, LFXP6E-4FN256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP6E-4FN256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFXP6E-4FN256C


FPGAs Lattice Semiconductor LFXP6E-4FN256C Overview

Introducing the robust and versatile FPGAs Lattice Semiconductor LFXP6E-4FN256C, a high-performance Field Programmable Gate Array designed by Lattice Semiconductor. This device is housed in a compact 256FBGA package and is specifically tailored for developers needing substantial I/O capabilities and flexibility. With 188 I/O pins, this FPGA enables efficient and scalable solutions in a variety of applications, ensuring reliable performance in demanding environments. Its advanced design accommodates rapid prototyping and customizations, making it an ideal choice for both new designs and upgrades to existing systems.

LFXP6E-4FN256C Features

The LFXP6E-4FN256C FPGA is packed with features that stand out in the semiconductor industry. Key attributes include its 256-ball fine pitch BGA (FBGA) packaging, which offers a space-saving footprint while allowing for a high degree of functionality and connectivity. The device supports a wide range of digital signal processing and logic functions, ensuring versatility in deployment. Its low power consumption makes it suitable for portable and power-sensitive applications, while its high-speed transceivers enable fast data transfer rates, crucial for high-performance computing tasks.

LFXP6E-4FN256C Applications

  • Consumer Electronics: Utilized in devices such as digital cameras, gaming consoles, and smart TVs, where its ample I/O capabilities and high-speed processing enhance user experience and functionality.
  • Telecommunications: Deployed in network routers and switches, improving bandwidth and reducing latency thanks to its efficient signal processing capabilities.
  • Automotive Systems: Integral to advanced driver-assistance systems (ADAS), where it processes inputs from multiple sensors to enhance vehicle safety and performance.
  • Industrial Automation: Used in control systems for manufacturing equipment, where its ability to handle complex logic operations optimizes machinery efficiency and reliability.
  • Medical Devices: Applied in medical imaging systems, such as ultrasound and MRI machines, helping to accelerate data processing speeds while maintaining high precision and reliability.
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