LFXP10C-3FN256I
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- Mfr.Part #
- LFXP10C-3FN256I
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 188 I/O 256FBGA
- Stock
- 1,064
- In Stock ：
- 1,064
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Peak Reflow Temperature (Cel) :
- 250
- Number of CLBs :
- 1216
- Lead Free :
- Lead Free
- Height Seated (Max) :
- 2.1mm
- RoHS Status :
- RoHS Compliant
- Number of Gates :
- 4
- Terminal Form :
- Ball
- Mounting Type :
- Surface Mount
- Width :
- 17mm
- Published :
- 2007
- Voltage - Supply :
- 1.71V~3.465V
- JESD-609 Code :
- e1
- Organization :
- 1216 CLBS
- Power Supplies :
- 1.8/2.5/3.3V
- Packaging :
- Tray
- Number of Logic Blocks (LABs) :
- 1250
- ECCN Code :
- EAR99
- Pbfree Code :
- yes
- Operating Temperature :
- -40°C~100°C TJ
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of I/O :
- 188
- Package / Case :
- 256-BGA
- Combinatorial Delay of a CLB-Max :
- 0.63 ns
- Terminal Position :
- BOTTOM
- Pin Count :
- 256
- Series :
- XP
- Operating Supply Voltage :
- 1.8V
- Base Part Number :
- LFXP10
- Memory Size :
- 31.9kB
- Length :
- 17mm
- Number of Logic Cells :
- 1216
- RAM Size :
- 27kB
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Frequency :
- 320MHz
- Terminal Pitch :
- 1mm
- Mount :
- Surface Mount
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 10000
- Number of Pins :
- 256
- Qualification Status :
- Not Qualified
- Total RAM Bits :
- 221184
- Supply Voltage :
- 1.8V
- Number of Outputs :
- 188
- Number of Terminations :
- 256
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Factory Lead Time :
- 10 Weeks
- Datasheets
- LFXP10C-3FN256I
LFXP10C-3FN256I Documents
FPGAs Lattice Semiconductor LFXP10C-3FN256I Overview
Introducing the high-performance FPGAs Lattice Semiconductor LFXP10C-3FN256I, a robust Field Programmable Gate Array (FPGA) designed by Lattice Semiconductor. This device is tailored for designers who demand superior flexibility and efficiency in integrating complex systems onto a single chip. It features a compact 256FBGA package and is equipped with 188 programmable I/Os, making it exceptionally versatile for a variety of applications. The LFXP10C-3FN256I is optimized for minimal power consumption while delivering high-speed performance, making it an ideal choice for developers looking to enhance their hardware with reliable, high-performance computing power.
LFXP10C-3FN256I Features
The LFXP10C-3FN256I FPGA is packed with features that make it a prime choice for advanced system integration. Key features include a dense 256 ball grid array (BGA) package, providing substantial space-saving advantages. Additionally, it supports a broad range of I/O standards, which are essential for interfacing with other hardware components. This FPGA also offers excellent power efficiency, which is critical for portable and low-power applications. Its robust design and flexible programming capabilities allow for rapid prototyping and deployment in complex multi-device environments.
LFXP10C-3FN256I Applications
- Consumer Electronics: Utilized in smart home devices and personal electronics, the LFXP10C-3FN256I enables responsive and flexible user interfaces and connectivity solutions.
- Automotive: Serves in driver assistance systems where its ability to process multiple inputs and outputs simultaneously enhances the safety and functionality of automotive electronics.
- Industrial Control: Applied in machine control systems, this FPGA can handle complex algorithms required for automation and real-time process control.
- Telecommunications: Helps in the development of communication infrastructure, including routers and switches, where high data throughput and reliability are needed.
- Medical Devices: Integral in medical imaging systems, the LFXP10C-3FN256I’s capacity for rapid data processing supports advanced diagnostics and treatment technology.
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