LFXP10C-3FN256I

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Mfr.Part #
LFXP10C-3FN256I
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 188 I/O 256FBGA
Stock
1,064
In Stock :
1,064

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Operating Temperature :
-40°C~100°C TJ
Peak Reflow Temperature (Cel) :
250
Packaging :
Tray
Mount :
Surface Mount
Number of Outputs :
188
Package / Case :
256-BGA
Lead Free :
Lead Free
Frequency :
320MHz
Supply Voltage :
1.8V
Number of Logic Blocks (LABs) :
1250
Terminal Pitch :
1mm
Series :
XP
Height Seated (Max) :
2.1mm
RAM Size :
27kB
Organization :
1216 CLBS
Terminal Form :
Ball
Number of CLBs :
1216
Time@Peak Reflow Temperature-Max (s) :
40
Base Part Number :
LFXP10
Pin Count :
256
ECCN Code :
EAR99
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Width :
17mm
Number of Gates :
4
Mounting Type :
Surface Mount
RoHS Status :
RoHS Compliant
Length :
17mm
Memory Size :
31.9kB
Number of Logic Cells :
1216
Total RAM Bits :
221184
Terminal Position :
BOTTOM
Factory Lead Time :
10 Weeks
Number of Terminations :
256
Power Supplies :
1.8/2.5/3.3V
Published :
2007
Combinatorial Delay of a CLB-Max :
0.63 ns
JESD-609 Code :
e1
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of Logic Elements/Cells :
10000
Voltage - Supply :
1.71V~3.465V
Terminal Finish :
Tin/Silver/Copper (Sn/Ag/Cu)
Qualification Status :
Not Qualified
Pbfree Code :
yes
Number of Pins :
256
Operating Supply Voltage :
1.8V
Number of I/O :
188
Datasheets
LFXP10C-3FN256I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP10C-3FN256I from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:-40°C~100°C TJ, Package / Case:256-BGA, Base Part Number:LFXP10, Mounting Type:Surface Mount, Number of Terminations:256, Number of Pins:256, LFXP10C-3FN256I pinout, LFXP10C-3FN256I datasheet PDF, LFXP10C-3FN256I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP10C-3FN256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFXP10C-3FN256I


FPGAs Lattice Semiconductor LFXP10C-3FN256I Overview

Introducing the high-performance FPGAs Lattice Semiconductor LFXP10C-3FN256I, a robust Field Programmable Gate Array (FPGA) designed by Lattice Semiconductor. This device is tailored for designers who demand superior flexibility and efficiency in integrating complex systems onto a single chip. It features a compact 256FBGA package and is equipped with 188 programmable I/Os, making it exceptionally versatile for a variety of applications. The LFXP10C-3FN256I is optimized for minimal power consumption while delivering high-speed performance, making it an ideal choice for developers looking to enhance their hardware with reliable, high-performance computing power.

LFXP10C-3FN256I Features

The LFXP10C-3FN256I FPGA is packed with features that make it a prime choice for advanced system integration. Key features include a dense 256 ball grid array (BGA) package, providing substantial space-saving advantages. Additionally, it supports a broad range of I/O standards, which are essential for interfacing with other hardware components. This FPGA also offers excellent power efficiency, which is critical for portable and low-power applications. Its robust design and flexible programming capabilities allow for rapid prototyping and deployment in complex multi-device environments.

LFXP10C-3FN256I Applications

  • Consumer Electronics: Utilized in smart home devices and personal electronics, the LFXP10C-3FN256I enables responsive and flexible user interfaces and connectivity solutions.
  • Automotive: Serves in driver assistance systems where its ability to process multiple inputs and outputs simultaneously enhances the safety and functionality of automotive electronics.
  • Industrial Control: Applied in machine control systems, this FPGA can handle complex algorithms required for automation and real-time process control.
  • Telecommunications: Helps in the development of communication infrastructure, including routers and switches, where high data throughput and reliability are needed.
  • Medical Devices: Integral in medical imaging systems, the LFXP10C-3FN256I’s capacity for rapid data processing supports advanced diagnostics and treatment technology.
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