LFXP6C-3F256C

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Mfr.Part #
LFXP6C-3F256C
Manufacturer
Lattice Semiconductor
Package / Case
256-BGA
Datasheet
Download
Description
IC FPGA 188 I/O 256FBGA
Stock
18,203
In Stock :
18,203

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
1.71V~3.465V
Combinatorial Delay of a CLB-Max :
0.63 ns
Supply Voltage :
1.8V
Number of Pins :
256
Mount :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Package / Case :
256-BGA
Number of CLBs :
720
Lead Free :
Lead Free
Terminal Form :
Ball
Number of Terminations :
256
Length :
17mm
Number of I/O :
188
Operating Temperature :
0°C~85°C TJ
Qualification Status :
Not Qualified
Power Supplies :
1.8/2.5/3.3V
Series :
XP
Published :
2007
Number of Logic Cells :
720
Pin Count :
256
ECCN Code :
EAR99
JESD-609 Code :
e0
Terminal Position :
BOTTOM
Width :
17mm
Organization :
720 CLBS
Memory Size :
11.9kB
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Terminal Pitch :
1mm
Terminal Finish :
Tin/Lead (Sn63Pb37)
Reach Compliance Code :
not_compliant
Operating Supply Voltage :
1.8V
Max Frequency :
320MHz
RAM Size :
9kB
Mounting Type :
Surface Mount
Base Part Number :
LFXP6
Peak Reflow Temperature (Cel) :
225
Pbfree Code :
No
Packaging :
Tray
Number of Logic Elements/Cells :
6000
HTS Code :
8542.39.00.01
Number of Outputs :
188
Total RAM Bits :
73728
RoHS Status :
Non-RoHS Compliant
Time@Peak Reflow Temperature-Max (s) :
30
Height Seated (Max) :
2.1mm
Number of Logic Blocks (LABs) :
750
Datasheets
LFXP6C-3F256C
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP6C-3F256C from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:256, Package / Case:256-BGA, Number of Terminations:256, Operating Temperature:0°C~85°C TJ, Mounting Type:Surface Mount, Base Part Number:LFXP6, LFXP6C-3F256C pinout, LFXP6C-3F256C datasheet PDF, LFXP6C-3F256C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP6C-3F256C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFXP6C-3F256C


FPGAs Lattice Semiconductor LFXP6C-3F256C Overview

The Lattice Semiconductor LFXP6C-3F256C FPGA offers a powerful solution for hardware designers looking to deploy flexible and adaptable systems in a compact form factor. This Field Programmable Gate Array stands out for its ability to handle complex computational tasks and digital processing at high speeds, thanks to its robust architecture. With its dense 256FBGA packaging, the LFXP6C-3F256C is ideal for applications where space is at a premium but performance cannot be compromised. The integration of 188 I/O ports facilitates extensive connectivity and versatility, making it a prime choice for designers aiming to develop high-performance, multi-functional devices. Utilizing the FPGAs Lattice Semiconductor LFXP6C-3F256C in your projects ensures a scalable and efficient design pathway, pivotal for rapid prototyping and mass production in today's fast-evolving technological landscape.

LFXP6C-3F256C Features

This FPGA from Lattice Semiconductor boasts numerous features that enhance its functionality and utility in complex electronic systems:

  • High I/O Pin Count: Incorporates 188 I/O ports enabling extensive connectivity options for various peripherals and interfaces.
  • Compact 256FBGA Package: Offers a space-efficient footprint that is critical in densely packed electronic assemblies.
  • Flexible Programming and Configuration: Supports multiple configuration options, allowing for tailored functionality to meet specific application requirements.
  • High-Speed Digital Processing: Capable of handling a wide array of digital signals and data processing tasks efficiently.

LFXP6C-3F256C Applications

  • Consumer Electronics: Utilized in devices such as smartphones and tablets to manage various functionalities through its flexible I/O options and processing power.
  • Industrial Automation: Acts as a control unit in automation systems, where its ability to rapidly process multiple inputs and outputs is critical for operational efficiency.
  • Automotive Systems: Integrates into driver assistance systems, providing the necessary computation and connectivity for sensor integration and real-time data processing.
  • Telecommunications: Essential in the development of communication equipment, where its high-speed signal processing capabilities support complex algorithms and data transmission protocols.
  • Healthcare Devices: Used in medical imaging systems, where its high I/O count and processing power help in the rapid and accurate delivery of medical diagnostics.
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