LFXP3E-3Q208I

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Mfr.Part #
LFXP3E-3Q208I
Manufacturer
Lattice Semiconductor
Package / Case
208-BFQFP
Datasheet
Download
Description
IC FPGA 136 I/O 208QFP
Stock
13,050
In Stock :
13,050

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Package / Case :
208-BFQFP
Pin Count :
208
Combinatorial Delay of a CLB-Max :
0.63 ns
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of CLBs :
384
Mounting Type :
Surface Mount
Lead Free :
Lead Free
Voltage - Supply :
1.14V~1.26V
Pbfree Code :
No
Max Frequency :
320MHz
Height Seated (Max) :
4.1mm
Operating Supply Voltage :
1.2V
RoHS Status :
Non-RoHS Compliant
Number of Logic Blocks (LABs) :
375
ECCN Code :
EAR99
Number of Outputs :
136
Time@Peak Reflow Temperature-Max (s) :
30
Peak Reflow Temperature (Cel) :
225
Series :
XP
Number of Logic Cells :
384
Number of Pins :
208
RAM Size :
6.8kB
Supply Voltage :
1.2V
Operating Temperature :
-40°C~100°C TJ
Terminal Form :
Gull wing
Terminal Position :
QUAD
Mount :
Surface Mount
Number of Logic Elements/Cells :
3000
Terminal Pitch :
0.5mm
Reach Compliance Code :
Unknown
Qualification Status :
Not Qualified
Packaging :
Tray
Published :
2000
Number of Terminations :
208
Terminal Finish :
Tin/Lead (Sn85Pb15)
Total RAM Bits :
55296
Memory Size :
8.3kB
JESD-609 Code :
e0
Base Part Number :
LFXP3
Organization :
384 CLBS
Number of I/O :
136
Number of Gates :
2
Datasheets
LFXP3E-3Q208I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP3E-3Q208I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:208-BFQFP, Mounting Type:Surface Mount, Number of Pins:208, Operating Temperature:-40°C~100°C TJ, Number of Terminations:208, Base Part Number:LFXP3, LFXP3E-3Q208I pinout, LFXP3E-3Q208I datasheet PDF, LFXP3E-3Q208I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP3E-3Q208I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFXP3E-3Q208I


FPGAs Lattice Semiconductor LFXP3E-3Q208I Overview

The LFXP3E-3Q208I, a premier FPGA (Field Programmable Gate Array) from Lattice Semiconductor, stands out in the industry for its exceptional integration and versatility. This device is designed to cater to engineers requiring high I/O capabilities in compact hardware configurations. It features a robust 208-pin Quad Flat Pack (QFP) that facilitates dense circuit integration while maintaining a manageable footprint on the PCB. FPGAs Lattice Semiconductor LFXP3E-3Q208I are perfect for applications demanding a mix of high-speed signal processing and low power consumption, making them a top choice for innovative electronics development.

LFXP3E-3Q208I Features

The LFXP3E-3Q208I FPGA is equipped with 136 user I/Os which provide ample flexibility for various design needs. This array allows for extensive peripheral connectivity and supports multiple configurable logic blocks for tailored functionality. The device also boasts a low-power architecture, which is crucial for energy-sensitive applications, enhancing system reliability and efficiency. With its easy-to-program nature and support for advanced encryption, the LFXP3E-3Q208I ensures secure and efficient operation, making it an ideal solution for a wide range of technical challenges.

LFXP3E-3Q208I Applications

  • Consumer Electronics: Utilized in devices such as smart TVs and gaming consoles, where its ability to handle multiple I/O operations simultaneously enhances user experience.
  • Industrial Automation: Plays a critical role in robotics and control systems, enabling complex, real-time decision making and process control in manufacturing environments.
  • Automotive Applications: Integral to advanced driver-assistance systems (ADAS) where rapid signal processing is necessary for safety features like obstacle detection and response systems.
  • Telecommunications: Used in network equipment, supporting the high-speed processing demands of modern communications infrastructure.
  • Medical Devices: Key component in diagnostic and imaging equipment, where precision and reliability are paramount for effective patient care.
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