LFXP3C-3Q208I

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Mfr.Part #
LFXP3C-3Q208I
Manufacturer
Lattice Semiconductor
Package / Case
208-BFQFP
Datasheet
Download
Description
IC FPGA 136 I/O 208QFP
Stock
44,920
In Stock :
44,920

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Mount :
Surface Mount
Series :
XP
Terminal Position :
QUAD
Qualification Status :
Not Qualified
Mounting Type :
Surface Mount
Number of I/O :
136
Number of Terminations :
208
Number of CLBs :
384
Number of Logic Cells :
384
RoHS Status :
Non-RoHS Compliant
Number of Pins :
208
Voltage - Supply :
1.71V~3.465V
JESD-609 Code :
e0
Number of Gates :
2
Number of Logic Elements/Cells :
3000
Max Frequency :
320MHz
Base Part Number :
LFXP3
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
-40°C~100°C TJ
Terminal Pitch :
0.5mm
Peak Reflow Temperature (Cel) :
225
Published :
2000
Number of Outputs :
136
Height Seated (Max) :
4.1mm
RAM Size :
6.8kB
Reach Compliance Code :
Unknown
Terminal Form :
Gull wing
Lead Free :
Lead Free
Packaging :
Tray
Number of Logic Blocks (LABs) :
375
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Pin Count :
208
Supply Voltage :
1.8V
Organization :
384 CLBS
Time@Peak Reflow Temperature-Max (s) :
30
Total RAM Bits :
55296
ECCN Code :
EAR99
Package / Case :
208-BFQFP
Terminal Finish :
Tin/Lead (Sn85Pb15)
Combinatorial Delay of a CLB-Max :
0.63 ns
Operating Supply Voltage :
1.8V
Memory Size :
8.3kB
Pbfree Code :
No
Datasheets
LFXP3C-3Q208I
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP3C-3Q208I from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Number of Terminations:208, Number of Pins:208, Base Part Number:LFXP3, Operating Temperature:-40°C~100°C TJ, Package / Case:208-BFQFP, LFXP3C-3Q208I pinout, LFXP3C-3Q208I datasheet PDF, LFXP3C-3Q208I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP3C-3Q208I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFXP3C-3Q208I


FPGAs Lattice Semiconductor LFXP3C-3Q208I Overview

Introducing the LFXP3C-3Q208I from Lattice Semiconductor, a high-performance FPGA (Field Programmable Gate Array) designed to meet the demanding needs of modern electronics. This device is part of Lattice's LatticeXP family, known for its versatile programmability and low power consumption. The LFXP3C-3Q208I is engineered to offer robust I/O capabilities within a compact 208QFP package, making it ideal for applications requiring dense configurations and minimal footprint. This FPGA is an excellent choice for designers looking to leverage a combination of speed, efficiency, and flexibility in their hardware solutions.

LFXP3C-3Q208I Features

The LFXP3C-3Q208I boasts an array of features suited for a wide range of applications. It features 136 user I/Os, allowing extensive interfacing with other digital systems and components. The non-volatile configuration memory enhances device security and simplifies the system design by eliminating the need for external configuration sources. Its performance is optimized for low-power operations, which is crucial for portable and energy-sensitive applications. Furthermore, its quick startup capabilities are essential for applications that require rapid activation and deployment.

LFXP3C-3Q208I Applications

  • Consumer Electronics: Used in devices such as smartphones, tablets, and wearables to provide flexible logic for user interface and peripheral management.
  • Industrial Automation: Integrates into control systems for sensors and actuators, enhancing processing capabilities and system reliability in harsh environments.
  • Automotive: Contributes to advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors for real-time decision making.
  • Telecommunications: Supports infrastructure by managing data flow and signal processing in network equipment.
  • Medical Devices: Utilized in medical imaging systems, enabling complex digital processing tasks that are required for high-resolution diagnostics.
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