LFXP2-8E-5FTN256C
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- Mfr.Part #
- LFXP2-8E-5FTN256C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-LBGA
- Datasheet
- Download
- Description
- IC FPGA 201 I/O 256FTBGA
- Stock
- 8,668
- In Stock ：
- 8,668
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Temperature :
- 0°C~85°C TJ
- Length :
- 17mm
- Number of I/O :
- 201
- Supply Voltage :
- 1.2V
- Mounting Type :
- Surface Mount
- Power Supplies :
- 1.21.2/3.33.3V
- Number of Outputs :
- 201
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- JESD-609 Code :
- e1
- Number of Macro Cells :
- 4000
- Published :
- 2008
- Packaging :
- Tray
- Frequency :
- 311MHz
- Number of Terminations :
- 256
- Terminal Pitch :
- 1mm
- Voltage - Supply :
- 1.14V~1.26V
- Total RAM Bits :
- 226304
- Terminal Form :
- Ball
- Pbfree Code :
- yes
- RAM Size :
- 27.6kB
- Package / Case :
- 256-LBGA
- Height :
- 1.25mm
- Series :
- XP2
- HTS Code :
- 8542.39.00.01
- Density :
- 239 kb
- Terminal Position :
- BOTTOM
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Radiation Hardening :
- No
- Peak Reflow Temperature (Cel) :
- 260
- ECCN Code :
- EAR99
- RoHS Status :
- ROHS3 Compliant
- Number of Pins :
- 256
- Combinatorial Delay of a CLB-Max :
- 0.494 ns
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 8000
- Factory Lead Time :
- 8 Weeks
- Operating Supply Voltage :
- 1.2V
- Base Part Number :
- LFXP2-8
- Number of LABs/CLBs :
- 1000
- Width :
- 17mm
- Memory Size :
- 29.9kB
- REACH SVHC :
- No SVHC
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Mount :
- Surface Mount
- Pin Count :
- 256
- Lead Free :
- Lead Free
- Datasheets
- LFXP2-8E-5FTN256C
FPGAs Lattice Semiconductor LFXP2-8E-5FTN256C Overview
Introducing the LFXP2-8E-5FTN256C from Lattice Semiconductor, a cutting-edge FPGA (Field Programmable Gate Array) designed to meet the rigorous demands of modern digital applications. This component is particularly engineered to deliver high performance and flexibility with its 201 I/O capabilities housed in a compact 256FTBGA package. The FPGA is optimized for power-sensitive and space-constrained applications, making it an essential selection for designers looking to innovate and scale their electronic solutions efficiently. The FPGAs Lattice Semiconductor LFXP2-8E-5FTN256C is the cornerstone for developing next-generation electronics that require robust, versatile, and high-speed programmable logic solutions.
LFXP2-8E-5FTN256C Features
The LFXP2-8E-5FTN256C FPGA boasts a range of features designed for superior performance and ease of integration. Key features include 201 user-configurable I/O ports which provide extensive versatility for various digital and analog connections. The 256FTBGA packaging allows for a compact footprint, while still offering the robust capability and connectivity required for complex digital circuits. Enhanced with low power consumption and high reliability, this FPGA is ideal for deploying in a wide array of operating environments.
LFXP2-8E-5FTN256C Applications
- Consumer Electronics: Utilized in devices such as smartphones, tablets, and wearables where space and power efficiency are paramount. The FPGA can manage multiple functionalities like sensor integration and signal processing efficiently.
- Automotive Applications: Critical in the development of automotive electronics, such as driver assistance systems and infotainment units, providing necessary processing power and interfacing capabilities.
- Industrial Automation: Acts as a control system component in complex industrial machines and processes, enabling fast processing times and adaptable functionality for various automation needs.
- Telecommunications: Supports infrastructure for both consumer and industrial telecommunications networks, facilitating enhanced data processing capabilities and connectivity.
- Medical Devices: Key in medical imaging systems and diagnostic equipment, where precise and reliable data processing is critical for patient care and monitoring.
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