LFXP2-30E-7FN672C

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Mfr.Part #
LFXP2-30E-7FN672C
Manufacturer
Lattice Semiconductor
Package / Case
672-BBGA
Datasheet
Download
Description
IC FPGA 472 I/O 672FPBGA
Stock
17,603
In Stock :
17,603

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Radiation Hardening :
No
HTS Code :
8542.39.00.01
Mount :
Surface Mount
Terminal Form :
Ball
ECCN Code :
EAR99
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Combinatorial Delay of a CLB-Max :
0.304 ns
Packaging :
Tray
Length :
27mm
Number of Outputs :
472
Power Supplies :
1.21.2/3.33.3V
Terminal Position :
BOTTOM
Operating Temperature :
0°C~85°C TJ
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Supply Voltage :
1.2V
RAM Size :
48.4kB
Package / Case :
672-BBGA
Base Part Number :
LFXP2-30
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of LABs/CLBs :
3625
Number of Pins :
672
Published :
2013
Voltage - Supply :
1.14V~1.26V
Memory Size :
55.4kB
Height Seated (Max) :
2.6mm
Number of Terminations :
672
Total RAM Bits :
396288
Mounting Type :
Surface Mount
Peak Reflow Temperature (Cel) :
250
Terminal Pitch :
1mm
Time@Peak Reflow Temperature-Max (s) :
30
Width :
27mm
RoHS Status :
ROHS3 Compliant
Number of I/O :
472
Series :
XP2
Operating Supply Voltage :
1.2V
Factory Lead Time :
8 Weeks
Lead Free :
Lead Free
Clock Frequency :
435MHz
Number of Logic Elements/Cells :
29000
Pin Count :
672
JESD-609 Code :
e1
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP2-30E-7FN672C from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~85°C TJ, Package / Case:672-BBGA, Base Part Number:LFXP2-30, Number of Pins:672, Number of Terminations:672, Mounting Type:Surface Mount, LFXP2-30E-7FN672C pinout, LFXP2-30E-7FN672C datasheet PDF, LFXP2-30E-7FN672C amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP2-30E-7FN672C ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFXP2-30E-7FN672C


FPGAs Lattice Semiconductor LFXP2-30E-7FN672C Overview

The Lattice Semiconductor LFXP2-30E-7FN672C FPGA stands out in the realm of integrated circuits for its high functionality and adaptability. Designed to meet the rigorous demands of modern digital systems, this FPGA offers a versatile solution for a wide range of applications. Featuring a dense 672-pin flip-chip Ball Grid Array (FBGA) package, it provides substantial I/O capabilities with 472 programmable inputs and outputs, making it ideal for complex, multi-functional systems. This high level of integration is suited for developers looking to maximize performance while minimizing the footprint of their designs, making the FPGAs Lattice Semiconductor LFXP2-30E-7FN672C a premier choice for innovation in advanced electronic systems.

LFXP2-30E-7FN672C Features

This FPGA module includes several features that make it highly valuable for a wide array of technological applications. It supports a variety of logic design configurations, enabling users to customize the device to meet specific functional requirements. The flexible programmable nature of the LFXP2-30E-7FN672C, combined with its robust I/O capabilities, ensures that it can handle high-speed signal processing and data management tasks efficiently.

LFXP2-30E-7FN672C Applications

  • Telecommunications Equipment: Utilized in routers and switches, the LFXP2-30E-7FN672C can manage multiple data streams simultaneously, optimizing network efficiency and speed.
  • Consumer Electronics: Applied in smart home devices and advanced personal gadgets, this FPGA enhances user interfaces and connectivity, ensuring seamless integration and improved user experiences.
  • Automotive Systems: Essential for driver-assistance systems, the LFXP2-30E-7FN672C processes multiple inputs from various sensors to provide real-time responses, enhancing vehicle safety and functionality.
  • Industrial Automation: In automated production lines, this FPGA controls machinery with precision, coordinating complex operations to increase throughput and decrease production errors.
  • Medical Devices: Supports critical functions in medical imaging systems, where its ability to process large volumes of data quickly aids in delivering accurate and timely diagnostic results.
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