LFXP2-30E-6FN672C
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- Mfr.Part #
- LFXP2-30E-6FN672C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 672-BBGA
- Datasheet
- Download
- Description
- IC FPGA 472 I/O 672FPBGA
- Stock
- 14,679
- In Stock ：
- 14,679
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Supply Voltage :
- 1.2V
- Terminal Position :
- BOTTOM
- Length :
- 27mm
- Terminal Form :
- Ball
- Height Seated (Max) :
- 2.6mm
- Base Part Number :
- LFXP2-30
- Reach Compliance Code :
- not_compliant
- Mounting Type :
- Surface Mount
- Clock Frequency :
- 435MHz
- Width :
- 27mm
- Memory Size :
- 55.4kB
- Published :
- 2009
- Number of Logic Elements/Cells :
- 29000
- Mount :
- Surface Mount
- Pin Count :
- 672
- Power Supplies :
- 1.21.2/3.33.3V
- Number of Pins :
- 672
- Voltage - Supply :
- 1.14V~1.26V
- ECCN Code :
- EAR99
- Number of Terminations :
- 672
- Number of LABs/CLBs :
- 3625
- Operating Supply Voltage :
- 1.2V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Qualification Status :
- Not Qualified
- Lead Free :
- Lead Free
- Total RAM Bits :
- 396288
- Number of I/O :
- 472
- Number of Outputs :
- 472
- Packaging :
- Tray
- JESD-609 Code :
- e1
- Series :
- XP2
- HTS Code :
- 8542.39.00.01
- Terminal Pitch :
- 1mm
- Combinatorial Delay of a CLB-Max :
- 0.399 ns
- Peak Reflow Temperature (Cel) :
- 250
- RoHS Status :
- ROHS3 Compliant
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Package / Case :
- 672-BBGA
- Factory Lead Time :
- 8 Weeks
- Operating Temperature :
- 0°C~85°C TJ
- RAM Size :
- 48.4kB
- Datasheets
- LFXP2-30E-6FN672C
FPGAs Lattice Semiconductor LFXP2-30E-6FN672C Overview
The LFXP2-30E-6FN672C from Lattice Semiconductor stands out in the market of FPGAs (Field Programmable Gate Arrays) with its robust feature set and superior performance metrics designed for advanced electronic designs. This IC FPGA is tailored to meet the intricate demands of modern digital systems, offering a substantial array of 472 I/Os packaged neatly in a 672FPBGA format. The integration of a high I/O count in a compact BGA package makes it highly suitable for dense board layouts where space and functionality are at a premium. This product excels in applications requiring flexible yet powerful computing solutions, as it provides designers the ability to reprogram the logic to suit multiple scenarios and updates post-deployment.
LFXP2-30E-6FN672C Features
The Lattice Semiconductor LFXP2-30E-6FN672C FPGA boasts a series of features that enhance its adaptability and efficiency in complex electronic environments. Key features include a high-density 672-ball fine pitch BGA package, which ensures a reduced footprint on system boards. The device also supports a broad range of I/O standards, facilitating easier integration into existing designs without the need for extensive rework. Additionally, its reprogrammable logic allows for iterative development and deployment, critical in rapidly evolving technological landscapes.
LFXP2-30E-6FN672C Applications
- Telecommunications: Utilized in networking hardware such as routers and switches, the LFXP2-30E-6FN672C helps manage data flow efficiently and adapt to new protocols as they emerge.
- Consumer Electronics: Applied in smart home devices, this FPGA allows for high flexibility in control and connectivity options, enhancing user interaction and functionality.
- Automotive Systems: In vehicle infotainment systems and advanced driver-assistance systems (ADAS), the FPGA enables high-speed processing and real-time responsiveness critical for safety and entertainment features.
- Industrial Automation: The robust I/O capabilities make it ideal for control systems in manufacturing lines, improving automation precision and reliability.
- Medical Devices: Used in medical imaging systems, the LFXP2-30E-6FN672C supports complex algorithm processing for clearer imaging and faster diagnostics.
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