LFXP2-30E-6FN484C
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- Mfr.Part #
- LFXP2-30E-6FN484C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 484-BBGA
- Datasheet
- Download
- Description
- IC FPGA 363 I/O 484FBGA
- Stock
- 10,001
- In Stock ：
- 10,001
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Operating Supply Voltage :
- 1.2V
- Published :
- 2009
- Mount :
- Surface Mount
- Operating Temperature :
- 0°C~85°C TJ
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 250
- Height Seated (Max) :
- 2.6mm
- Terminal Form :
- Ball
- Number of Pins :
- 484
- HTS Code :
- 8542.39.00.01
- Pin Count :
- 484
- Package / Case :
- 484-BBGA
- Voltage - Supply :
- 1.14V~1.26V
- Power Supplies :
- 1.21.2/3.33.3V
- Number of Outputs :
- 363
- Length :
- 23mm
- Number of I/O :
- 363
- Series :
- XP2
- Supply Voltage :
- 1.2V
- Base Part Number :
- LFXP2-30
- Factory Lead Time :
- 8 Weeks
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Width :
- 23mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of LABs/CLBs :
- 3625
- Total RAM Bits :
- 396288
- Terminal Position :
- BOTTOM
- RAM Size :
- 48.4kB
- Mounting Type :
- Surface Mount
- ECCN Code :
- EAR99
- RoHS Status :
- ROHS3 Compliant
- Combinatorial Delay of a CLB-Max :
- 0.399 ns
- Qualification Status :
- Not Qualified
- Memory Size :
- 55.4kB
- Lead Free :
- Lead Free
- Clock Frequency :
- 435MHz
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e1
- Number of Terminations :
- 484
- Number of Logic Elements/Cells :
- 29000
- Terminal Pitch :
- 1mm
- Datasheets
- LFXP2-30E-6FN484C
FPGAs Lattice Semiconductor LFXP2-30E-6FN484C Overview
The LFXP2-30E-6FN484C from Lattice Semiconductor exemplifies cutting-edge technology in the realm of Field Programmable Gate Arrays (FPGAs). Designed to offer a flexible and efficient solution for hardware designers, this FPGA integrates a vast array of functionalities and a high density of I/O options within a compact 484FBGA package. As a versatile component, it is engineered to address the increasing demands of sophisticated electronic systems, making it a prime choice for developers looking to push the boundaries of innovation while optimizing system cost and performance. The integration of 363 I/O ports makes it exceptionally capable in handling extensive data transfers and interfacing with multiple peripherals, which is crucial for complex, multi-functional devices.
LFXP2-30E-6FN484C Features
This particular model boasts a robust feature set that includes high-speed performance, a significant number of I/O ports, and a compact form factor which is ideal for space-constrained applications. Additionally, the FPGA is known for its lower power consumption, which is critically important for portable and energy-sensitive applications. Its programmability allows for rapid prototyping and quick adjustments during the development phase, significantly reducing time to market for new products.
LFXP2-30E-6FN484C Applications
- Consumer Electronics: Utilized in devices like smartphones, tablets, and smart watches where space and power efficiency are paramount. The high number of I/Os and adaptability of the FPGA facilitates faster data processing and richer feature integration in these compact devices.
- Automotive Systems: Employed in advanced driver-assistance systems (ADAS) to process inputs from multiple sensors for features such as collision detection and parking assistance. Its ability to handle complex algorithms quickly makes it suitable for safety-critical applications in modern vehicles.
- Industrial Automation: Used in control systems and robotics for real-time processing of sensor data and machine control. The FPGA's versatility and robustness enable it to perform reliably in harsh industrial environments, managing multiple tasks simultaneously.
- Telecommunications: Integral to network infrastructure, handling signal processing tasks, and data flow management. Its high-speed processing capabilities ensure efficient data transmission and system integrity in communication networks.
- Medical Devices: Applied in medical imaging systems like X-ray and MRI for fast data processing and real-time image reconstruction, improving diagnostic capabilities and patient outcomes through enhanced image clarity and detail.
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