LFXP2-30E-5FN672I
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- Mfr.Part #
- LFXP2-30E-5FN672I
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 672-BBGA
- Datasheet
- Download
- Description
- IC FPGA 472 I/O 672FPBGA
- Stock
- 49,095
- In Stock ：
- 49,095
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Pins :
- 672
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Power Supplies :
- 1.21.2/3.33.3V
- Number of I/O :
- 472
- Pin Count :
- 672
- RoHS Status :
- ROHS3 Compliant
- Voltage - Supply :
- 1.14V~1.26V
- ECCN Code :
- EAR99
- Base Part Number :
- LFXP2-30
- Qualification Status :
- Not Qualified
- Packaging :
- Tray
- Terminal Form :
- Ball
- Series :
- XP2
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Pitch :
- 1mm
- Operating Temperature :
- -40°C~100°C TJ
- Width :
- 27mm
- Clock Frequency :
- 435MHz
- Number of Terminations :
- 672
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Published :
- 2009
- Mount :
- Surface Mount
- Mounting Type :
- Surface Mount
- Package / Case :
- 672-BBGA
- HTS Code :
- 8542.39.00.01
- JESD-609 Code :
- e1
- Terminal Position :
- BOTTOM
- Total RAM Bits :
- 396288
- Combinatorial Delay of a CLB-Max :
- 0.494 ns
- Supply Voltage :
- 1.2V
- Peak Reflow Temperature (Cel) :
- 250
- Number of Outputs :
- 472
- Factory Lead Time :
- 8 Weeks
- Number of Logic Elements/Cells :
- 29000
- Length :
- 27mm
- Reach Compliance Code :
- not_compliant
- Height Seated (Max) :
- 2.6mm
- Lead Free :
- Lead Free
- RAM Size :
- 48.4kB
- Number of LABs/CLBs :
- 3625
- Datasheets
- LFXP2-30E-5FN672I
LFXP2-30E-5FN672I Documents
FPGAs Lattice Semiconductor LFXP2-30E-5FN672I Overview
The FPGAs Lattice Semiconductor LFXP2-30E-5FN672I is a highly versatile, field-programmable gate array (FPGA) that excels in providing innovative solutions for complex digital computations. Manufactured by Lattice Semiconductor, this product offers a robust platform for developing high-performance, multi-functional devices across a range of applications. The IC integrates 472 I/O pins in a compact 672FPBGA package, designed to meet the rigorous demands of high-speed signal processing and dense electronic environments. This makes it an ideal choice for designers looking to push the boundaries of technology with scalable, cost-effective solutions.
LFXP2-30E-5FN672I Features
This FPGA boasts numerous features that make it a preferred option for advanced system-on-chip (SoC) developments. Key features include a high I/O pin count which facilitates versatile interfacing options, a fine-pitched 672-ball flip-chip BGA package that ensures minimal footprint and optimal thermal performance, and support for various logic density configurations which provides designers with flexibility to optimize their designs according to specific requirements.
LFXP2-30E-5FN672I Applications
- Communications Infrastructure: The LFXP2-30E-5FN672I is adept at handling the intensive processing requirements of modern telecommunications equipment. It enables efficient data flow management and high-speed signal processing which are essential in routers, switches, and base stations.
- Consumer Electronics: This FPGA can be embedded into consumer electronic devices such as digital cameras, gaming consoles, and smart TVs to enhance multimedia handling capabilities, including faster image processing and improved user interface responsiveness.
- Industrial Automation: In industrial settings, the robustness of the LFXP2-30E-5FN672I supports automation systems by facilitating real-time control and monitoring, thus improving manufacturing precision and reliability.
- Automotive Applications: The high I/O capability and rugged design of the FPGA make it suitable for automotive applications, including driver assistance systems and infotainment units, where reliability and performance under extreme conditions are crucial.
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