LFXP2-17E-5FTN256I

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Mfr.Part #
LFXP2-17E-5FTN256I
Manufacturer
Lattice Semiconductor
Package / Case
256-LBGA
Datasheet
Download
Description
IC FPGA 201 I/O 256FTBGA
Stock
990
In Stock :
990

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
Length :
17mm
Memory Size :
38.9kB
Time@Peak Reflow Temperature-Max (s) :
40
Voltage - Supply :
1.14V~1.26V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Height Seated (Max) :
2.1mm
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Pbfree Code :
yes
Total RAM Bits :
282624
Number of Outputs :
201
Width :
17mm
Radiation Hardening :
No
Pin Count :
256
Mount :
Surface Mount
Package / Case :
256-LBGA
Supply Voltage :
1.2V
Mounting Type :
Surface Mount
Number of Pins :
256
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Power Supplies :
1.21.2/3.33.3V
Number of LABs/CLBs :
2125
JESD-609 Code :
e1
Factory Lead Time :
8 Weeks
Terminal Pitch :
1mm
Number of Terminations :
256
Base Part Number :
LFXP2-17
Peak Reflow Temperature (Cel) :
260
Number of I/O :
201
Number of Logic Elements/Cells :
17000
Clock Frequency :
435MHz
Terminal Position :
BOTTOM
ECCN Code :
EAR99
Published :
2012
RoHS Status :
ROHS3 Compliant
Operating Supply Voltage :
1.2V
Packaging :
Tray
Operating Temperature :
-40°C~100°C TJ
Lead Free :
Lead Free
Series :
XP2
HTS Code :
8542.39.00.01
Combinatorial Delay of a CLB-Max :
0.494 ns
RAM Size :
34.5kB
Terminal Form :
Ball
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP2-17E-5FTN256I from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:256-LBGA, Mounting Type:Surface Mount, Number of Pins:256, Number of Terminations:256, Base Part Number:LFXP2-17, Operating Temperature:-40°C~100°C TJ, LFXP2-17E-5FTN256I pinout, LFXP2-17E-5FTN256I datasheet PDF, LFXP2-17E-5FTN256I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFXP2-17E-5FTN256I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFXP2-17E-5FTN256I


FPGAs Lattice Semiconductor LFXP2-17E-5FTN256I Overview

The FPGAs Lattice Semiconductor LFXP2-17E-5FTN256I represents a cutting-edge solution in the field of programmable logic devices. Designed by Lattice Semiconductor, this FPGA (Field Programmable Gate Array) is crafted to deliver high performance, versatility, and efficiency in a compact form factor. The LFXP2-17E-5FTN256I, housed in a 256FTBGA package, is particularly noted for its robust I/O capabilities with up to 201 pins available for multifaceted interfacing. This makes it an ideal choice for developers looking to implement complex logic circuits and systems integration without compromising on space or power consumption. Its inherent programmability allows for rapid prototyping and modifications, thus accelerating time-to-market for a wide array of products.

LFXP2-17E-5FTN256I Features

This FPGA boasts a comprehensive set of features that make it highly adaptable and suitable for a diverse range of applications. Key features include a high-density I/O interface, a fine-grained programmable logic structure, and low power consumption. The device's integration in a 256FTBGA package ensures minimized footprint while maximizing reliability and connectivity, thus enabling complex system designs in space-constrained environments.

LFXP2-17E-5FTN256I Applications

  • Consumer Electronics: Utilized in devices such as smartphones and tablets to provide flexible, high-speed I/O options and support for multiple functionalities while maintaining compactness and efficiency.
  • Industrial Automation: Empowers sophisticated control systems with its ability to handle multiple input and output configurations, improving process automation and machine-to-machine communication.
  • Automotive Technology: Applied in advanced driver-assistance systems (ADAS) to integrate various sensors and actuators, enhancing vehicle safety and performance.
  • Telecommunications: Key in developing communication infrastructure, supporting rapid signal processing capabilities essential for high-speed data transfer and network reliability.
  • Healthcare Devices: Integral in medical imaging systems and diagnostic equipment, providing necessary processing power and connectivity for complex image and data analysis.
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