LFXP10E-5FN256C
- Mfr.Part #
- LFXP10E-5FN256C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 188 I/O 256FBGA
- Stock
- 16,837
- In Stock :
- 16,837
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- JESD-609 Code :
- e1
- Width :
- 17mm
- Number of CLBs :
- 1216
- Number of I/O :
- 188
- RAM Size :
- 27kB
- Voltage - Supply :
- 1.14V~1.26V
- Lead Free :
- Lead Free
- Number of Logic Blocks (LABs) :
- 1250
- Number of Outputs :
- 188
- Mount :
- Surface Mount
- Number of Logic Cells :
- 1216
- Height Seated (Max) :
- 2.1mm
- Frequency :
- 400MHz
- RoHS Status :
- RoHS Compliant
- Mounting Type :
- Surface Mount
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Terminal Position :
- BOTTOM
- Number of Pins :
- 256
- Radiation Hardening :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Total RAM Bits :
- 221184
- Supply Voltage :
- 1.2V
- Terminal Form :
- Ball
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Pitch :
- 1mm
- ECCN Code :
- EAR99
- Number of Terminations :
- 256
- Number of Gates :
- 4
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Length :
- 17mm
- Organization :
- 1216 CLBS
- Memory Size :
- 31.9kB
- Pbfree Code :
- yes
- Number of Logic Elements/Cells :
- 10000
- Operating Supply Voltage :
- 1.2V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pin Count :
- 256
- Published :
- 2007
- Package / Case :
- 256-BGA
- Base Part Number :
- LFXP10
- Series :
- XP
- Peak Reflow Temperature (Cel) :
- 250
- Packaging :
- Tray
- Datasheets
- LFXP10E-5FN256C
LFXP10E-5FN256C Documents

FPGAs Lattice Semiconductor LFXP10E-5FN256C Overview
Introducing the FPGAs Lattice Semiconductor LFXP10E-5FN256C, a highly versatile and powerful Field Programmable Gate Array (FPGA) designed to meet the evolving needs of modern digital systems. This FPGA from Lattice Semiconductor offers a robust platform for developers, incorporating a flexible architecture that supports a wide range of applications. With its 256FBGA package, it ensures a compact footprint while providing 188 I/O options, making it an excellent choice for projects requiring a high degree of connectivity and functionality in a condensed space.
LFXP10E-5FN256C Features
The LFXP10E-5FN256C FPGA is notable for its high functionality and adaptability. Key features include a dense 256 ball grid array (BGA) packaging, which facilitates more efficient space utilization and improved thermal characteristics. Additionally, the 188 I/O pins available enhance its ability to handle multiple inputs and outputs simultaneously, which is crucial for high-speed digital processing and data-intensive applications.
LFXP10E-5FN256C Applications
- Consumer Electronics: Utilized in devices such as smartphones and tablets, the LFXP10E-5FN256C helps manage multiple functionalities while maintaining device performance and efficiency.
- Automotive Systems: Supports advanced automotive applications, including infotainment systems and electronic control units, providing robust performance under rigorous conditions.
- Industrial Automation: Ideal for use in complex industrial automation systems, enabling sophisticated control and monitoring of machinery with high reliability and precision.
- Telecommunication Infrastructure: Applied in telecommunications equipment, this FPGA assists in handling high-speed signal processing and data flow, crucial for network reliability and efficiency.
- Medical Devices: Enhances functionality and reliability in medical devices, including imaging systems and diagnostic equipment, ensuring precise and efficient patient care.
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