LFXP10E-3FN256I
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- Mfr.Part #
- LFXP10E-3FN256I
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 188 I/O 256FBGA
- Stock
- 39,516
- In Stock ：
- 39,516
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Gates :
- 4
- Organization :
- 1216 CLBS
- Number of I/O :
- 188
- Qualification Status :
- Not Qualified
- Operating Temperature :
- -40°C~100°C TJ
- Memory Size :
- 31.9kB
- Base Part Number :
- LFXP10
- Pin Count :
- 256
- Terminal Position :
- BOTTOM
- Package / Case :
- 256-BGA
- RoHS Status :
- RoHS Compliant
- Peak Reflow Temperature (Cel) :
- 250
- Height Seated (Max) :
- 2.1mm
- Number of Pins :
- 256
- Supply Voltage :
- 1.2V
- Max Frequency :
- 320MHz
- Number of Logic Blocks (LABs) :
- 1250
- Published :
- 2007
- ECCN Code :
- EAR99
- JESD-609 Code :
- e1
- Width :
- 17mm
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Series :
- XP
- Number of Logic Elements/Cells :
- 10000
- Number of Logic Cells :
- 1216
- Total RAM Bits :
- 221184
- Length :
- 17mm
- Number of Terminations :
- 256
- Operating Supply Voltage :
- 1.2V
- Mount :
- Surface Mount
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Pbfree Code :
- yes
- Lead Free :
- Lead Free
- Mounting Type :
- Surface Mount
- Voltage - Supply :
- 1.14V~1.26V
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Number of CLBs :
- 1216
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Combinatorial Delay of a CLB-Max :
- 0.63 ns
- RAM Size :
- 27kB
- Number of Outputs :
- 188
- Packaging :
- Tray
- Terminal Pitch :
- 1mm
- Terminal Form :
- Ball
- Datasheets
- LFXP10E-3FN256I
LFXP10E-3FN256I Documents
FPGAs Lattice Semiconductor LFXP10E-3FN256I Overview
The LFXP10E-3FN256I from Lattice Semiconductor represents a high-performance solution within the FPGA (Field Programmable Gate Array) market. Designed to deliver efficient processing with a flexible logic architecture, this IC FPGA is ideal for developers looking for scalable and adaptable hardware options. Its package in a compact 256FBGA format allows for a dense and robust configuration, supporting a wide array of digital and mixed-signal applications. With 188 I/O options, this FPGA provides ample connectivity, facilitating easier integration into existing systems while supporting expansive new designs. The utilization of the FPGAs Lattice Semiconductor LFXP10E-3FN256I in complex digital environments highlights its capacity to meet critical design and performance specifications.
LFXP10E-3FN256I Features
This Lattice FPGA product is equipped with 188 I/O pins housed in a compact 256-ball fine pitch ball grid array (FBGA) package, which ensures a minimal footprint on system boards while maximizing functionality. The device supports a variety of design applications due to its versatile input/output configuration and high-speed digital processing capabilities. Furthermore, its robustness in harsh environments makes it a reliable choice for demanding applications.
LFXP10E-3FN256I Applications
- Industrial Automation: The FPGA can be used to manage complex control systems and machinery operations, enhancing precision and efficiency in industrial settings.
- Telecommunications: Essential in the development of telecommunications equipment, the FPGA facilitates faster data processing and improved signal integrity for both wired and wireless communication systems.
- Consumer Electronics: Utilized in consumer electronics, the FPGA enables product enhancements including advanced user interfaces and increased functionality in devices such as smart TVs and gaming consoles.
- Automotive Applications: Supports advanced driver-assistance systems (ADAS) and infotainment systems, providing reliable processing power needed for vehicle safety and entertainment features.
- Medical Devices: In medical devices, the FPGA supports functionalities such as imaging processing and real-time patient monitoring systems, ensuring quick and accurate medical services.
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