LFXP10E-3F256I
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- Mfr.Part #
- LFXP10E-3F256I
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 256-BGA
- Datasheet
- Download
- Description
- IC FPGA 188 I/O 256FBGA
- Stock
- 40,892
- In Stock ：
- 40,892
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of Logic Elements/Cells :
- 10000
- Length :
- 17mm
- RoHS Status :
- Non-RoHS Compliant
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- ECCN Code :
- EAR99
- RAM Size :
- 27kB
- Published :
- 2007
- Pin Count :
- 256
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Cells :
- 1216
- Series :
- XP
- Height Seated (Max) :
- 2.1mm
- Width :
- 17mm
- Operating Supply Voltage :
- 1.2V
- JESD-609 Code :
- e0
- Supply Voltage :
- 1.2V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Lead Free :
- Lead Free
- HTS Code :
- 8542.39.00.01
- Combinatorial Delay of a CLB-Max :
- 0.63 ns
- Total RAM Bits :
- 221184
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Terminal Position :
- BOTTOM
- Number of CLBs :
- 1216
- Number of Terminations :
- 256
- Number of Pins :
- 256
- Pbfree Code :
- No
- Number of I/O :
- 188
- Package / Case :
- 256-BGA
- Organization :
- 1216 CLBS
- Voltage - Supply :
- 1.14V~1.26V
- Reach Compliance Code :
- not_compliant
- Mount :
- Surface Mount
- Number of Logic Blocks (LABs) :
- 1250
- Mounting Type :
- Surface Mount
- Max Frequency :
- 320MHz
- Operating Temperature :
- -40°C~100°C TJ
- Memory Size :
- 31.9kB
- Peak Reflow Temperature (Cel) :
- 225
- Base Part Number :
- LFXP10
- Terminal Pitch :
- 1mm
- Packaging :
- Tray
- Number of Outputs :
- 188
- Datasheets
- LFXP10E-3F256I
LFXP10E-3F256I Documents
FPGAs Lattice Semiconductor LFXP10E-3F256I Overview
The LFXP10E-3F256I, manufactured by Lattice Semiconductor, represents a robust and versatile field-programmable gate array (FPGA) solution, ideally suited for developers looking to harness a blend of performance and flexibility within their electronic designs. This particular model from the Lattice Semiconductor's FPGA lineup is designed to support a wide array of applications, from industrial control systems to consumer electronics, thanks to its substantial I/O capabilities and compact 256FBGA packaging. With its rich feature set and high integration level, the FPGAs Lattice Semiconductor LFXP10E-3F256I ensures that developers can achieve high-speed, reliable functionalities in their targeted applications, making it a crucial component for high-demand systems.
LFXP10E-3F256I Features
The LFXP10E-3F256I FPGA is equipped with 188 programmable I/O pins, providing ample flexibility for interfacing with a wide range of peripheral devices. Packaged in a compact 256-ball fine pitch ball grid array (FBGA), it offers a minimized footprint suitable for space-constrained applications. The device also supports advanced encryption for secure data applications, making it ideal for use in systems where data integrity and security are paramount.
LFXP10E-3F256I Applications
- Consumer Electronics: Utilized in devices such as smart watches, gaming consoles, and high-definition multimedia interfaces (HDMI), where its ability to quickly reprogram allows for rapid prototyping and updates.
- Industrial Automation: In industrial control systems, the LFXP10E-3F256I enhances process automation by adapting to various sensor inputs and control outputs, facilitating complex automation tasks.
- Automotive: Used in automotive applications such as infotainment systems and advanced driver-assistance systems (ADAS), where its high I/O count and robust performance are critical for real-time processing.
- Telecommunications: Integral to the development of telecommunications infrastructure, including FPGA-based wireless base stations and network routers that require high-speed signal processing.
- Medical Devices: Applies in medical imaging systems like ultrasounds and MRIs, where its fast processing capabilities enable real-time image processing and analysis.
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