LFSCM3GA80EP1-6FFN1152I
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- Mfr.Part #
- LFSCM3GA80EP1-6FFN1152I
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 1152-BBGA
- Datasheet
- Download
- Description
- IC FPGA 660 I/O 1152FBGA
- Stock
- 35,910
- In Stock ：
- 35,910
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Supply Voltage :
- 1.2V
- Terminal Form :
- Ball
- Mounting Type :
- Surface Mount
- ECCN Code :
- EAR99
- Number of CLBs :
- 308
- Series :
- SCM
- Factory Lead Time :
- 8 Weeks
- Base Part Number :
- LFSCM3GA80
- Number of Outputs :
- 660
- Terminal Pitch :
- 1mm
- HTS Code :
- 8542.39.00.01
- Power Supplies :
- 1.21.2/3.32.5V
- Number of I/O :
- 660
- Voltage - Supply :
- 0.95V~1.26V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RAM Size :
- 710kB
- Operating Temperature :
- -40°C~105°C TJ
- Packaging :
- Tray
- Number of Pins :
- 1152
- Length :
- 35mm
- Terminal Position :
- BOTTOM
- Clock Frequency :
- 1000MHz
- Width :
- 35mm
- Qualification Status :
- Not Qualified
- Height Seated (Max) :
- 3.5mm
- RoHS Status :
- RoHS Compliant
- Total RAM Bits :
- 5816320
- Mount :
- Surface Mount
- Package / Case :
- 1152-BBGA
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Cells :
- 80100
- Number of LABs/CLBs :
- 20000
- Published :
- 2011
- Number of Logic Elements/Cells :
- 80000
- Datasheets
- LFSCM3GA80EP1-6FFN1152I
FPGAs Lattice Semiconductor LFSCM3GA80EP1-6FFN1152I Overview
The FPGAs Lattice Semiconductor LFSCM3GA80EP1-6FFN1152I is a high-performance FPGA designed to meet the complex processing demands of modern embedded systems. This IC FPGA model from Lattice Semiconductor features an impressive array of 660 I/O pins housed within a compact 1152FBGA package. The architecture of this FPGA facilitates rapid prototyping and deployment of custom hardware accelerators and allows engineers to optimize system functions with considerable flexibility and scalability.
LFSCM3GA80EP1-6FFN1152I Features
The LFSCM3GA80EP1-6FFN1152I FPGA offers a robust platform for developing advanced applications, thanks to its expansive I/O capabilities and high-density ball grid array packaging. The device is characterized by its ability to support a wide variety of digital and analog functionalities, making it an ideal choice for designers looking to push the boundaries of hardware optimization and integration.
LFSCM3GA80EP1-6FFN1152I Applications
- Telecommunications Infrastructure: Applied in routers and switches to manage data traffic efficiently and enable high-speed data transmission.
- Automotive Systems: Used in advanced driver-assistance systems (ADAS) for processing and sensor data integration, enhancing vehicle safety and performance.
- Industrial Automation: Facilitates complex control systems and real-time processing tasks, optimizing automation and monitoring processes in factories.
- Consumer Electronics: Integral to the development of consumer electronics, such as high-performance gaming consoles and smart home devices, ensuring responsive user interactions and connectivity.
- Medical Equipment: Supports the design of medical imaging devices and diagnostic equipment, providing the necessary computational power and reliability required in healthcare technologies.
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