LFSCM3GA80EP1-6FF1152C
- Mfr.Part #
- LFSCM3GA80EP1-6FF1152C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 1152-BBGA
- Datasheet
- Download
- Description
- IC FPGA 660 I/O 1152FCBGA
- Stock
- 2
- In Stock :
- 2
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Number of I/O :
- 660
- Number of LABs/CLBs :
- 20000
- Lead Free :
- Lead Free
- Operating Temperature :
- 0°C~85°C TJ
- RAM Size :
- 710kB
- Base Part Number :
- LFSCM3GA80
- Number of Pins :
- 1152
- Package / Case :
- 1152-BBGA
- Packaging :
- Tray
- Number of Logic Elements/Cells :
- 80000
- ECCN Code :
- EAR99
- Published :
- 2011
- Mounting Type :
- Surface Mount
- Series :
- SCM
- HTS Code :
- 8542.39.00.01
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- Non-RoHS Compliant
- Total RAM Bits :
- 5816320
- Mount :
- Surface Mount
- Reach Compliance Code :
- not_compliant
- Voltage - Supply :
- 0.95V~1.26V
- Datasheets
- LFSCM3GA80EP1-6FF1152C

FPGAs Lattice Semiconductor LFSCM3GA80EP1-6FF1152C Overview
The LFSCM3GA80EP1-6FF1152C, a robust FPGA from Lattice Semiconductor, is engineered to deliver superior performance and flexibility for today’s demanding electronic environments. This Field Programmable Gate Array (FPGA) is equipped with a dense array of programmable logic gates, enabling it to perform a wide range of digital computations and processing tasks in real-time. Designed for advanced applications, the LFSCM3GA80EP1-6FF1152C offers a rich set of features including 660 I/O pins housed in a compact 1152FCBGA package. This makes it an ideal solution for developers looking for scalable, high-performance components that can be tailored to meet specific design requirements.
LFSCM3GA80EP1-6FF1152C Features
This FPGA from Lattice Semiconductor is equipped with extensive features to handle complex integration and rapid prototyping tasks. Key attributes include a high I/O pin count, large gate density, and the ability to support various logic configurations. Its 1152FCBGA packaging allows for robust performance in a compact footprint, ensuring optimal board space utilization and enhanced thermal management, making it suitable for high-density applications.
LFSCM3GA80EP1-6FF1152C Applications
- Telecommunications: Employed in data processing units within communication infrastructure, supporting high-speed data transfer and signal processing capabilities essential for modern telecom networks.
- Automotive Systems: Integral in the design of automotive electronics for sensor management, infotainment systems, and real-time vehicle monitoring, enhancing both performance and safety.
- Industrial Automation: Provides the processing power necessary for control systems in automated production lines, increasing efficiency and reliability in high-demand manufacturing environments.
- Consumer Electronics: Used in the development of consumer electronics such as smart devices and home entertainment systems, where flexibility and high processing capability are required for multimedia processing and connectivity.
- Medical Devices: Critical for medical imaging and diagnostic equipment, ensuring fast and accurate processing capabilities that are vital for patient care and medical research.
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