LFSCM3GA25EP1-7F900C
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- Mfr.Part #
- LFSCM3GA25EP1-7F900C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 378 I/O 900FBGA
- Stock
- 25,591
- In Stock ：
- 25,591
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- ECCN Code :
- EAR99
- Mounting Type :
- Surface Mount
- Number of CLBs :
- 104
- Pbfree Code :
- No
- Number of Pins :
- 900
- Series :
- SCM
- Max Frequency :
- 700MHz
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Terminations :
- 900
- Terminal Pitch :
- 1mm
- Lead Free :
- Lead Free
- Terminal Finish :
- Tin/Lead (Sn63Pb37)
- Reach Compliance Code :
- not_compliant
- Number of Logic Elements/Cells :
- 25000
- Packaging :
- Tray
- Peak Reflow Temperature (Cel) :
- 225
- Total RAM Bits :
- 1966080
- Number of I/O :
- 378
- RAM Size :
- 240kB
- Pin Count :
- 900
- Base Part Number :
- LFSCM3GA25
- Number of Logic Cells :
- 25400
- Length :
- 31mm
- Number of Outputs :
- 378
- Time@Peak Reflow Temperature-Max (s) :
- 30
- RoHS Status :
- Non-RoHS Compliant
- Terminal Position :
- BOTTOM
- Width :
- 31mm
- Mount :
- Surface Mount
- Voltage - Supply :
- 0.95V~1.26V
- Published :
- 2008
- Number of LABs/CLBs :
- 6250
- JESD-609 Code :
- e0
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- Package / Case :
- 900-BBGA
- Height Seated (Max) :
- 2.6mm
- Operating Temperature :
- 0°C~85°C TJ
- Supply Voltage :
- 1.2V
- Operating Supply Voltage :
- 1.2V
- Power Supplies :
- 1.21.2/3.32.5V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- HTS Code :
- 8542.39.00.01
- Datasheets
- LFSCM3GA25EP1-7F900C
FPGAs Lattice Semiconductor LFSCM3GA25EP1-7F900C Overview
The FPGAs Lattice Semiconductor LFSCM3GA25EP1-7F900C is a high-performance FPGA (Field Programmable Gate Array) designed to meet the rigorous demands of modern digital applications. Manufactured by Lattice Semiconductor, a leader in smart connectivity solutions, this FPGA is housed in a 900FBGA (Fine Pitch Ball Grid Array) package, ensuring robust and reliable physical connectivity. Ideal for designers looking for flexible and scalable integration capabilities, this product features a comprehensive array of 378 I/O ports, allowing extensive peripheral and interfacing opportunities. The versatility of the LFSCM3GA25EP1-7F900C makes it an excellent choice for applications requiring rapid prototyping and complex digital computations.
LFSCM3GA25EP1-7F900C Features
This advanced FPGA device boasts an array of features designed for high scalability and performance in embedded processing. Key features include:
- 378 input/output ports for extensive interfacing capabilities.
- Encased in a 900FBGA package for improved thermal management and compact footprint.
- High configurability that suits a wide range of applications from industrial to consumer electronics.
- Robust design enabling reliable operation in diverse environmental conditions.
LFSCM3GA25EP1-7F900C Applications
- Telecommunications Infrastructure: Utilizes its high I/O count for managing multiple communication interfaces, enhancing signal processing capabilities essential for base stations and network routers.
- Automotive Electronics: Supports advanced driver-assistance systems (ADAS) by providing the necessary computational power and connectivity for sensors and actuators.
- Consumer Electronics: Ideal for high-definition video processing and complex digital signal management in devices such as smart TVs and gaming consoles.
- Industrial Automation: Powers process control systems by handling multiple sensor inputs and actuator outputs, improving automation and efficiency in manufacturing settings.
- Medical Devices: Suitable for medical imaging equipment, leveraging its extensive I/O capabilities to handle high data throughput and real-time processing requirements.
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