LFSCM3GA25EP1-6F900I
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- Mfr.Part #
- LFSCM3GA25EP1-6F900I
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 378 I/O 900FBGA
- Stock
- 11,778
- In Stock ：
- 11,778
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- RoHS Status :
- Non-RoHS Compliant
- Series :
- SCM
- Number of I/O :
- 378
- RAM Size :
- 240kB
- Mount :
- Surface Mount
- Min Supply Voltage :
- 950mV
- Max Frequency :
- 700MHz
- Published :
- 2011
- Package / Case :
- 900-BBGA
- Mounting Type :
- Surface Mount
- Min Operating Temperature :
- -40°C
- Number of LABs/CLBs :
- 6250
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of Logic Elements/Cells :
- 25000
- Operating Temperature :
- -40°C~105°C TJ
- Lead Free :
- Lead Free
- Number of Logic Blocks (LABs) :
- 6250
- Total RAM Bits :
- 1966080
- Base Part Number :
- LFSCM3GA25
- Packaging :
- Tray
- Max Supply Voltage :
- 1.26V
- Voltage - Supply :
- 0.95V~1.26V
- Max Operating Temperature :
- 105°C
- Number of Pins :
- 900
- Supplier Device Package :
- 900-FPBGA (31x31)
- Datasheets
- LFSCM3GA25EP1-6F900I
FPGAs Lattice Semiconductor LFSCM3GA25EP1-6F900I Overview
The FPGAs Lattice Semiconductor LFSCM3GA25EP1-6F900I is a high-performance Field Programmable Gate Array designed to meet the rigorous demands of modern digital applications. Manufactured by Lattice Semiconductor, this IC is packaged in a dense 900FBGA format, providing a robust platform for intricate digital circuit designs. With 378 programmable I/O options, it offers versatility for a wide range of applications, from complex digital signal processing to high-speed data communication, ensuring efficient, scalable, and adaptable solutions. Ideal for designers looking to harness the power of FPGA technology for advanced system integration, this product represents a smart choice for businesses aiming to purchase in bulk and optimize their technological frameworks.
LFSCM3GA25EP1-6F900I Features
The LFSCM3GA25EP1-6F900I includes multiple features that make it an excellent choice for robust and flexible digital designs:
- High I/O Count: Provides 378 input/output options for extensive interfacing with other devices and systems.
- Dense Packaging: The 900FBGA packaging allows for a compact form factor, ideal for space-constrained applications.
- Programmability: Offers high levels of customization to meet specific system requirements, enhancing system performance and functionality.
LFSCM3GA25EP1-6F900I Applications
- Telecommunications: Utilized in the design of communication infrastructure to facilitate high-speed data transmission and signal processing.
- Automotive Systems: Employed in vehicle electronics for managing advanced driver-assistance systems (ADAS) and in-car networking.
- Consumer Electronics: Integrated into devices such as smartphones, tablets, and smart TVs, enhancing multimedia processing capabilities.
- Industrial Automation: Critical for control systems and automation technology, improving operational efficiency and reliability.
- Medical Devices: Applied in medical imaging and diagnostic equipment for faster data processing and real-time results.
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