LFSCM3GA25EP1-5FN900C
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- Mfr.Part #
- LFSCM3GA25EP1-5FN900C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 900-BBGA
- Datasheet
- Download
- Description
- IC FPGA 378 I/O 900FBGA
- Stock
- 17,349
- In Stock ：
- 17,349
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Width :
- 31mm
- Pin Count :
- 900
- Lead Free :
- Lead Free
- Terminal Position :
- BOTTOM
- Number of LABs/CLBs :
- 6250
- Number of CLBs :
- 104
- JESD-609 Code :
- e1
- Operating Supply Voltage :
- 1.2V
- Number of Outputs :
- 378
- Total RAM Bits :
- 1966080
- Peak Reflow Temperature (Cel) :
- 250
- RoHS Status :
- ROHS3 Compliant
- Length :
- 31mm
- Terminal Finish :
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Base Part Number :
- LFSCM3GA25
- Number of Pins :
- 900
- Qualification Status :
- Not Qualified
- Terminal Form :
- Ball
- HTS Code :
- 8542.39.00.01
- Packaging :
- Tray
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Pbfree Code :
- yes
- Factory Lead Time :
- 8 Weeks
- Max Frequency :
- 700MHz
- Number of Logic Cells :
- 25400
- RAM Size :
- 240kB
- Voltage - Supply :
- 0.95V~1.26V
- Number of Terminations :
- 900
- Mount :
- Surface Mount
- Number of Logic Elements/Cells :
- 25000
- Height Seated (Max) :
- 2.6mm
- Supply Voltage :
- 1.2V
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Series :
- SCM
- ECCN Code :
- EAR99
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Operating Temperature :
- 0°C~85°C TJ
- Terminal Pitch :
- 1mm
- Published :
- 2008
- Power Supplies :
- 1.21.2/3.32.5V
- Package / Case :
- 900-BBGA
- Reach Compliance Code :
- not_compliant
- Number of I/O :
- 378
- Datasheets
- LFSCM3GA25EP1-5FN900C
FPGAs Lattice Semiconductor LFSCM3GA25EP1-5FN900C Overview
The FPGAs Lattice Semiconductor LFSCM3GA25EP1-5FN900C is a state-of-the-art FPGA (Field Programmable Gate Array) designed for high-performance, complex digital systems. Engineered by Lattice Semiconductor, this IC is crafted to meet the rigorous demands of modern electronic environments. With 378 I/O ports housed in a 900FBGA (Fine Pitch Ball Grid Array) package, this device offers exceptional flexibility and scalability. This makes it an ideal solution for developers looking to rapidly prototype and deploy applications requiring dense, high-speed programmable logic.
LFSCM3GA25EP1-5FN900C Features
- 378 Input/Output Ports: Enables comprehensive connectivity for complex digital systems.
- 900FBGA Packaging: Provides a compact, reliable, and efficient mounting solution.
- Highly Scalable: Suitable for a variety of applications, from small projects to large-scale deployments.
LFSCM3GA25EP1-5FN900C Applications
- Telecommunications Equipment: Utilizes high I/O count for managing complex signal processing tasks essential in modern telecom infrastructures.
- Industrial Automation: Adaptable for control systems requiring high-speed data acquisition and processing.
- Consumer Electronics: Supports the development of sophisticated consumer electronics, such as smart home devices and advanced personal gadgets.
- Automotive Systems: Ideal for use in driver assistance systems and other automotive safety technologies requiring rapid processing and robust data handling.
- Medical Devices: Can be employed in medical imaging systems, where its extensive I/O capabilities facilitate high-resolution data processing and real-time diagnostic outputs.
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