LFSC3GA25E-6FFN1020I

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Mfr.Part #
LFSC3GA25E-6FFN1020I
Manufacturer
Lattice Semiconductor
Package / Case
1020-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 476 I/O 1020BGA
Stock
34,405
In Stock :
34,405

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Manufacturer :
Lattice Semiconductor
Product Category :
FPGAs (Field Programmable Gate Array)
RoHS Status :
RoHS Compliant
Height Seated (Max) :
3.82mm
Number of Pins :
1020
RAM Size :
240kB
Series :
SC
ECCN Code :
EAR99
Packaging :
Tray
Supply Voltage :
1.2V
Time@Peak Reflow Temperature-Max (s) :
40
Terminal Pitch :
1mm
Mount :
Surface Mount
Mounting Type :
Surface Mount
Total RAM Bits :
1966080
Lead Free :
Lead Free
Operating Supply Voltage :
1.2V
Number of Logic Elements/Cells :
25000
Terminal Finish :
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Number of LABs/CLBs :
6250
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Width :
33mm
Number of Outputs :
476
Operating Temperature :
-40°C~105°C TJ
Base Part Number :
LFSC3GA25
Qualification Status :
Not Qualified
HTS Code :
8542.39.00.01
Peak Reflow Temperature (Cel) :
245
Terminal Position :
BOTTOM
Voltage - Supply :
0.95V~1.26V
Published :
2010
Length :
33mm
Number of Logic Cells :
25400
Power Supplies :
1.21.2/3.32.5V
Package / Case :
1020-BBGA, FCBGA
Number of I/O :
476
Max Frequency :
700MHz
Terminal Form :
Ball
Number of CLBs :
104
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-609 Code :
e1
Introducing FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFSC3GA25E-6FFN1020I from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:1020, Mounting Type:Surface Mount, Operating Temperature:-40°C~105°C TJ, Base Part Number:LFSC3GA25, Package / Case:1020-BBGA, FCBGA, LFSC3GA25E-6FFN1020I pinout, LFSC3GA25E-6FFN1020I datasheet PDF, LFSC3GA25E-6FFN1020I amp .Beyond FPGAs (Field Programmable Gate Array) Lattice Semiconductor LFSC3GA25E-6FFN1020I ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Lattice Semiconductor LFSC3GA25E-6FFN1020I


FPGAs Lattice Semiconductor LFSC3GA25E-6FFN1020I Overview

The FPGAs Lattice Semiconductor LFSC3GA25E-6FFN1020I is a high-performance, field-programmable gate array designed for the advanced needs of modern embedded systems. This IC FPGA from Lattice Semiconductor integrates a robust 476 I/O pins, housed within a compact 1020BGA package, enabling vast connectivity and flexibility. Suited for demanding applications, the device supports a wide range of configurations and is perfect for designers looking for a versatile, scalable solution that meets stringent power, space, and speed requirements. Its architecture allows for rapid prototyping and customized adjustments, crucial for speeding up time-to-market in competitive industries.

LFSC3GA25E-6FFN1020I Features

This particular model boasts several key features, including its expansive 476 I/O options, providing extensive interface capabilities. The 1020BGA packaging ensures a compact form factor while enabling high-density integration, essential for today's miniaturized electronics. Enhanced programmability and flexibility in FPGA design make it a superior choice for complex electronic designs that require customizable logic solutions.

LFSC3GA25E-6FFN1020I Applications

  • Consumer Electronics: Utilized in devices such as smartphones and tablets, this FPGA can manage multiple functionalities while optimizing power and space utilization.
  • Industrial Automation: In industrial settings, the FPGA serves to control machinery by processing multiple input/output signals rapidly, enhancing operational efficiency and safety.
  • Automotive Systems: Key to advanced driver-assistance systems (ADAS), this FPGA processes inputs from various sensors to provide real-time responses, crucial for safety and performance enhancements in vehicles.
  • Data Centers: Supports infrastructure by facilitating high-speed data processing and storage solutions, ensuring robust data handling and improved security measures.
  • Telecommunications: This FPGA aids in managing and routing data efficiently across networks, critical for the backbone of communication services and enhancing bandwidth management.
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