LFECP6E-3TN144C
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- Mfr.Part #
- LFECP6E-3TN144C
- Manufacturer
- Lattice Semiconductor
- Package / Case
- 144-LQFP
- Datasheet
- Download
- Description
- IC FPGA 97 I/O 144TQFP
- Stock
- 12,185
- In Stock ：
- 12,185
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- Manufacturer :
- Lattice Semiconductor
- Product Category :
- FPGAs (Field Programmable Gate Array)
- HTS Code :
- 8542.39.00.01
- Supply Voltage :
- 1.2V
- Time@Peak Reflow Temperature-Max (s) :
- 40
- Number of Pins :
- 144
- Packaging :
- Tray
- Number of Logic Blocks (LABs) :
- 768
- Memory Size :
- 14.6kB
- Number of CLBs :
- 768
- RoHS Status :
- RoHS Compliant
- Published :
- 2000
- Mounting Type :
- Surface Mount
- Terminal Pitch :
- 0.5mm
- Height Seated (Max) :
- 1.6mm
- RAM Size :
- 11.5kB
- Operating Supply Voltage :
- 1.2V
- Series :
- ECP
- JESD-609 Code :
- e3
- Mount :
- Surface Mount
- Number of Outputs :
- 97
- Package / Case :
- 144-LQFP
- Peak Reflow Temperature (Cel) :
- 260
- Terminal Form :
- Gull wing
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells :
- 6100
- Length :
- 20mm
- Pin Count :
- 144
- Number of Terminations :
- 144
- Reach Compliance Code :
- Unknown
- Pbfree Code :
- yes
- ECCN Code :
- EAR99
- Operating Temperature :
- 0°C~85°C TJ
- Number of I/O :
- 97
- Total RAM Bits :
- 94208
- Combinatorial Delay of a CLB-Max :
- 0.56 ns
- Max Frequency :
- 340MHz
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Finish :
- Matte Tin (Sn)
- Lead Free :
- Lead Free
- Terminal Position :
- QUAD
- Power Supplies :
- 1.21.2/3.33.3V
- Voltage - Supply :
- 1.14V~1.26V
- Width :
- 20mm
- Base Part Number :
- LFECP6
- Qualification Status :
- Not Qualified
- Datasheets
- LFECP6E-3TN144C
FPGAs Lattice Semiconductor LFECP6E-3TN144C Overview
The LFECP6E-3TN144C by Lattice Semiconductor represents a sophisticated solution in the realm of FPGAs (Field Programmable Gate Arrays), designed to meet the versatile needs of modern electronics. This FPGA is housed in a 144TQFP package, making it ideal for compact yet powerful applications. With its ability to support 97 I/Os, it offers ample flexibility for various design integrations. This product stands out in the FPGA market for its balance between performance, power efficiency, and cost, making it a preferred choice for developers looking to leverage advanced digital circuit technology without compromising on system size or power consumption.
LFECP6E-3TN144C Features
The LFECP6E-3TN144C FPGA is equipped with several key features that make it a competitive product in its category. This includes a high I/O pin count in a relatively small 144-pin thin quad flat package (TQFP), which allows for a compact PCB footprint while still offering a robust interface for complex designs. Its configuration is optimized for logic density improvements, which enhance the overall performance of the FPGA. Additionally, the low power consumption design ensures that it can be used in energy-sensitive applications without sacrificing efficiency.
LFECP6E-3TN144C Applications
- Consumer Electronics: This FPGA can be integrated into devices such as smart TVs and gaming consoles, where its high I/O capacity and small size allow for enhanced multimedia processing and connectivity options in space-constrained environments.
- Industrial Automation: In automation systems, the LFECP6E-3TN144C's robust performance and support for numerous I/O options enable it to handle complex control systems and sensor networks, improving system reliability and functionality.
- Automotive Applications: The device's low power consumption and compact design make it suitable for automotive electronics, such as in-vehicle infotainment systems, where efficient power use is crucial and space is at a premium.
- Telecommunications: Used in network hardware, this FPGA helps manage data flow efficiently due to its high-speed I/O capabilities, which are essential for high-performance routers and switches.
- Medical Devices: Its ability to operate at low power with high integration makes it perfect for portable medical devices, ensuring patient safety and device efficacy in critical care applications.
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